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Intel SC5300BD2 Product Specification - Page 2

Revision History, Disclaimers - server

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Intel® Server Chassis SC5300 5U Kit TPS Introduction Revision History Date June 18, 2004 June 25, 2004 July 20 , 2004 Jan 5, 2005 Jan 16, 2006 Jan 16, 2006 Revision Number Modifications 1.0 1.1 1.1.1 1.2 1.3 1.31 Initial Release Format Updates Format updates SATA and SCSI backplane updates Incorporated T.H. Comments. Added BRP Added Errata/Integration Appendix SATA backplane updates - added SAS compatibility Modified Sections 1.3 and 1.4 Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Server Chassis SC5300 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel's own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation can not be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation. *Other brands and names may be claimed as the property of others. Copyright © Intel Corporation 2004-2005. Revision 1.31 1

Section	Page
Introduction	13
1.1 Intel® Server Chassis SC5300 Design Features	13
1.2 Intel® Server Chassis SC5300BASE Summary	15
1.3 Intel® Server Chassis SC5300BRP Summary	16
1.4 Intel® Server Chassis SC5300LX Summary	16
2. Chassis Features	18
2.1 Chassis Dimensions and Weight	18
System Colors	18
2.2.1 Pedestal and Rack Mount Features	18
2.3 Security	19
2.4 I/O Panel	19
2.5 Standard and Optional Hot Swap Drive Bays	20
2.6 5.25-inch Half-height Peripheral Bays	20
2.7 Chassis Views	21
3. Chassis Power Subsystem	23
3.1 600-W Power Supply	23
3.1.1 Mechanical Outline	23
3.1.2 Output Wire Harness	24
3.1.2.1 Baseboard power connector (P1)	27
3.1.2.2 Processor Power Connector (P2)	27
3.1.2.3 Power Signal Connector (P13)	28
3.1.2.4 Peripheral Power Connectors (P3, P4, and P6, P8 – P11)	28
3.1.2.5 Floppy Power Connector (P6)	29
3.1.2.6 PCI Express Connector (P15)	29
3.1.3 600-W Power Supply Airflow and Temperature Rise	29
3.1.4 AC Specifications	29
3.1.4.1 AC Inlet Connector	30
3.1.4.2 AC Input Voltage Specification	30
3.1.4.3 Efficiency	30
3.1.4.4 AC Line Dropout / Holdup	30
3.1.4.5 AC Line Fuse	30
3.1.5 600-W DC Output Specifications	31
3.1.5.1 Grounding	31
3.1.5.2 Output Voltage and Currents	31
3.1.5.3 Voltage Regulation	32
3.1.5.4 Standby Operation	32
3.1.6 600-W Protection Circuits	32
3.1.6.1 Over Voltage Protection	33
3.1.6.2 Over Temperature Protection	33
3.1.7 600-W Power Supply Control and Indicator Functions	33
3.1.7.1 PSON# Input Signal	33
3.1.7.2 PWOK (Power OK) Output Signal	33
3.1.8 Mean Time Between Failures (MTBF)	33
3.2 730-W Power Supply	33
3.2.1 730W Power Supply Mechanical Outline	34
3.2.2 Output Wire Harness	35
3.2.3 Airflow Requirements and Temperature Rise	35
3.2.4 AC Specifications	35
3.2.4.1 AC Input Voltage Specification	35
3.2.4.2 Efficiency	35
3.2.4.3 AC Line Fuse	36
3.2.5 730-W DC Specifications	36
3.2.5.1 Output Module Edge Connector	36
3.2.5.2 Output Power / Currents	37
3.2.5.3 Standby Outputs	37
3.2.5.4 Stand By Operation	38
3.2.5.5 Voltage Regulation	38
3.2.6 730-W Protection Circuits	38
3.2.6.1 Over Current Protection	38
3.2.6.2 Over Voltage Protection and Over Temperature	38
3.2.7 730-W Power Supply Control and Indicator Functions	39
3.2.7.1 PSON# Input Signal	39
3.2.7.2 PWOK Output Signal	39
3.2.7.3 PSKILL Signal Requirements	39
3.2.8 730-W Mean Time Between Failure (MTBF)	39
3.2.9 Redundant (1+1) Hot Swap Mode	39
3.3 730-W Power Distribution Board	39
3.3.1 Power Distribution Mechanical Overview	40
3.3.2 Temperature Operational Limits	42
3.3.3 Electrical Specification	42
3.3.3.1 Input Connectors	42
3.3.3.2 Baseboard Power Connector (P1)	43
3.3.3.3 Processor Power Connector (P2)	44
3.3.3.4 Peripheral Power Connectors (P3 - P5, P7 - P12)	44
3.3.3.5 Floppy Power Connector (P6)	44
3.3.3.6 Power Signal Connector P13	45
3.3.3.7 12V Output Load Requirements	45
3.3.3.8 DC/DC Converters Loading	46
3.3.3.9 Voltage Regulation	46
3.3.3.10 Fan-less Operation in Stand-by Mode	47
3.3.4 Protection Circuits	47
3.3.4.1 Over Current Protection (OCP) / 240VA Current Limit	47
3.3.4.2 Over Voltage Protection (OVP)	47
3.3.5 Control and Indicator Functions	47
3.3.5.1 PSON# Input and Output Signals	48
3.3.5.2 PSKILL	48
3.3.5.3 PWOK (Power OK) Input and Output Signals	48
3.3.5.4 lert# Output Signal	48
3.4 SMBus Monitoring Interface	48
3.4.1 Mean Time Between Failures (MTBF)	49
4. System Cooling	50
4.1 Fan Configuration	50
4.1.1 Processor Passive Heat Sink Cooling Solution	50
4.1.2 Base Cooling Solution	51
4.1.2 Redundant Cooling Solution	51
4.2 Fan Control	53
4.3 FAN Header Connector Descriptions	53
5. Hard Disk Drive Bays	54
5.1 Server Chassis SC5300 4HDD and 6HDD SCSI HSBP Overview	54
5.1.1 SCSI Enclosure Management Controller	54
5.1.2 SCSI Interface	55
5.1.2.1 I2C Serial Bus Interface	55
5.1.2.2 Temperature Sensor	55
5.1.2.3 Serial EEPROM	55
5.1.3 External Memory Device	55
5.1.4 Hot Swap Power Controller	55
5.1.5 SCSI Drive Connectors	55
5.1.6 Power Connectors	56
5.1.7 SCA2 SCSI Connector	56
5.1.8 68-Pin SCSI Connector	57
5.1.9 IPMB (I2C) Header	59
5.1.10 Power Budget	59
5.1.11 Hard Drive Activity and Fault LED	59
5.1.12 SCSI Backplane Status LEDs.	60
5.1.13 SCSI Hot Swap Drive Bay Upgrade Kits	62
5.2 SATA/SAS Hot Swap Backplane	62
5.2.1 Enclosure Management Controller	64
5.2.2 SATA/SAS Interface	64
5.2.3 I2C Serial Bus Interface	64
5.2.3.1 I2C Bus Address and Loading	65
5.2.3.2 Temperature Sensor	66
5.2.3.3 Serial EEPROM	66
5.2.4 General Purpose Input/Output (GPIO)	66
5.2.5 External Memory Device	68
5.2.6 LEDs	68
5.2.7 SATA/SAS Drive Connectors	68
5.2.8 Power Connectors	69
5.2.9 Clock Generation and Distribution	69
5.2.10 7-Pin SATA/SAS Connector – Drive0-Drive5	70
5.2.11 IPMB Header - IPMB	70
5.2.12 SATA/SAS Host I2C Header - I2C_1	71
5.2.13 Power Budget	71
5.2.14 Board Layout	71
5.2.15 Connector Specifications	72
5.2.16 SATA/SAS Hot Swap Drive Cage Upgrade Kit	73
6. Front Panel	74
6.1 Front Panel Board Layout	74
6.1.1 Front Panel Connectors	74
6.1.2 Front panel JP2 Header (17x2) Pin-out.	75
6.1.3 I2C Connectors at J1 and J2 (Not Installed) Pin-out	76
6.1.4 Front Panel Controls and Indicators	76
6.2 Chassis Interconnect	79
6.3 Chassis Internal Cables	80
6.3.1 Front Panel Cable	80
6.3.2 USB Cable and Connectors	81
6.3.3 Hot Swap Fan Cables and Connectors	81
6.3.4 SCSI Cable	83
6.3.5 Serial Cable	84
6.3.6 SATA Cable	84
6.3.7 IPMB cable for 6-Drive Bays (4-pin)	85
6.3.8 I2C Cable for 6-Drive Bays (3-pin)	85
7. System-Compatible Server Boards	86
8. Upgrade Accessories	87
8.1 AXX6SCSIDB and AXX4SCSIDB Hot Swap SCSI Drive Bays	87
8.2 SATA/SAS Hot Swap Drive Bay Upgrade Accessory AXX6SASDB	87
8.3 External SCSI Adapter Cable AXXEXTSCSICBL	87
8.4 Rack Conversion Kit ARIGRACK	87
9. Reliability, Serviceability, and Availability	88
9.1 MTBF	88
9.2 Serviceability	88
10. Environmental Limits	90
10.1 System Office Environment	90
10.2 System Environmental Testing	90
11. Product Regulatory Compliance	91
11.1 Product Safety Compliance	91
11.2 Product EMC Compliance	91
11.3 Product Regulatory Compliance Markings	91
11.4 Electromagnetic Compatibility Notices	92
11.4.1 USA	92
11.4.2 FCC Verification Statement	93
11.4.3 ICES-003 (Canada)	93
11.4.4 Europe (CE Declaration of Conformity)	93
11.4.5 Japan EMC Compatibility	93

Match case Limit results 1 per page

Intel® Server Chassis SC5300 5U Kit TPS

Introduction

Revision 1.31

Revision History

Date

Revision Number

Modifications

June 18, 2004

1.0

Initial Release

June 25, 2004

1.1

Format Updates

July 20 , 2004

1.1.1

Format updates

Jan 5, 2005

1.2

SATA and SCSI backplane updates Incorporated T.H.

Comments. Added BRP Added Errata/Integration Appendix

Jan 16, 2006

1.3

SATA backplane updates – added SAS compatibility

Jan 16, 2006

1.31

Modified Sections 1.3 and 1.4

Disclaimers

Information in this document is provided in connection with Intel

products. No license, express or

implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except

as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability

whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel

products including liability or warranties relating to fitness for a particular purpose, merchantability, or

infringement of any patent, copyright or other intellectual property right. Intel products are not intended for

use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and

product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked

"reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility

whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Server Chassis SC5300 may contain design defects or errors known as errata which may

cause the product to deviate from published specifications.

Current characterized errata are available on

request.

Intel Corporation server baseboards contain a number of high-density VLSI and power delivery

components that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the

intended thermal requirements of these components when the fully integrated system is used together. It

is the responsibility of the system integrator that chooses not to use Intel developed server building

blocks to consult vendor datasheets and operating parameters to determine the amount of air flow

required for their specific application and environmental conditions.

Intel Corporation can not be held

responsible if components fail or the server board does not operate correctly when used outside any of

their published operating or non-operating limits.

Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.