Intel SC5300BD2 Product Specification - Page 4

System Cooling - power supply

Page 4 highlights

Intel® Server Chassis SC5300 5U Kit TPS Introduction 3.1.8 Mean Time Between Failures (MTBF 32 3.2 730-W Power Supply 32 3.2.1 730W Power Supply Mechanical Outline 33 3.2.2 Output Wire Harness 34 3.2.3 Airflow Requirements and Temperature Rise 34 3.2.4 AC Specifications 34 3.2.5 730-W DC Specifications 35 3.2.6 730-W Protection Circuits 37 3.2.7 730-W Power Supply Control and Indicator Functions 38 3.2.8 730-W Mean Time Between Failure (MTBF 38 3.2.9 Redundant (1+1) Hot Swap Mode 38 3.3 730-W Power Distribution Board 38 3.3.1 Power Distribution Mechanical Overview 39 3.3.2 Temperature Operational Limits 41 3.3.3 Electrical Specification 41 3.3.4 Protection Circuits 46 3.3.5 Control and Indicator Functions 46 3.4 SMBus Monitoring Interface 47 3.4.1 Mean Time Between Failures (MTBF 48 4. System Cooling ...49 4.1 Fan Configuration 49 4.1.1 Processor Passive Heat Sink Cooling Solution 49 4.1.2 Base Cooling Solution 50 4.1.2 Redundant Cooling Solution 50 4.2 Fan Control 52 Revision 1.31 3

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IntelĀ® Server Chassis SC5300 5U Kit TPS
Introduction
Revision 1.31
3
3.1.8
Mean Time Between Failures (MTBF)
.......................................................
32
3.2
730-W Power Supply
.................................................................................
32
3.2.1
730W Power Supply Mechanical Outline
...................................................
33
3.2.2
Output
Wire Harness
................................................................................
34
3.2.3
Airflow Requirements and Temperature Rise
............................................
34
3.2.4
AC Specifications
.......................................................................................
34
3.2.5
730-W
DC Specifications
..........................................................................
35
3.2.6
730-W Protection Circuits
..........................................................................
37
3.2.7
730-W Power Supply Control and Indicator Functions
...............................
38
3.2.8
730-W Mean Time Between Failure (MTBF)
..............................................
38
3.2.9
Redundant (1+1) Hot Swap Mode
..............................................................
38
3.3
730-W Power Distribution Board
................................................................
38
3.3.1
Power Distribution Mechanical Overview
...................................................
39
3.3.2
Temperature Operational
Limits
................................................................
41
3.3.3
Electrical Specification
...............................................................................
41
3.3.4
Protection Circuits
......................................................................................
46
3.3.5
Control and Indicator Functions
.................................................................
46
3.4
SMBus Monitoring Interface
.......................................................................
47
3.4.1
Mean Time Between Failures (MTBF)
.......................................................
48
4.
System Cooling
.....................................................................................................
49
4.1
Fan Configuration
......................................................................................
49
4.1.1
Processor Passive Heat Sink Cooling Solution
..........................................
49
4.1.2
Base Cooling Solution
................................................................................
50
4.1.2
Redundant Cooling Solution
......................................................................
50
4.2
Fan Control
................................................................................................
52