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Intel SC5300BD2 Product Specification - Page 54

Server Chassis SC5300 4HDD and 6HDD SCSI HSBP Overview

UPC - 735858171755

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Intel® Server Chassis SC5300 5U Kit TPS Hard Disk Drive Bays 5. Hard Disk Drive Bays 5.1 Server Chassis SC5300 4HDD and 6HDD SCSI HSBP Overview The Server Chassis SC5300 4HDD or 6HDD SCSI Hot Swap Backplane (HSBP) is a monolithic printed circuit board. The architecture is based on the QLogic* GEM359 enclosure management controller and has support for up to 4 or 6 SCSI drives. The 4HDD and 6HDD SCSI HSBP supports the following feature set: • QLogic* GEM359 enclosure management controller o External non-volatile Flash ROM o Two I2C interfaces o Low Voltage Differential (LVD) SCSI Interface o SCSI-3 compatible o Compliance with SCSI Accessed Fault Tolerant Enclosures (SAF-TE) specification, version 1.00 and addendum o Compliance with Intelligent Platform Management Interface (IPMI) • Support for up to 4 or 6 each U320 LVD SCSI Drives o Onboard LVD SCSI Termination • Hot Swap Power Controller • Temperature Sensor • FRU EEPROM • Two 4-pin Standard HD Power Connectors 5.1.1 SCSI Enclosure Management Controller The QLogic* GEM359 is an enclosure management controller for the SCSI backplanes and monitors various aspects of a storage enclosure. The chip provides in-band SAF-TE and SES management through the SCSI interface. The GEM359 also supports the IPMI specification by providing management data to a baseboard management controller through the IPMB. The hot-swap SCSI backplane board set resides in the hot swap drive bay, which is included with the 650-W redundant chassis and/or is available as an upgrade. The SCSI interface on the LVD SCSI backplane provides the link between the SCSI bus and the SCSI Accessed Fault Tolerant Enclosure (SAF-TE) controller. The SAF-TE interface allows the enclosure management controller to respond as a SCSI target to implement the SAF-TE protocol. Power control on the LVD SCSI backplane supports the following features. • Spin-down of a drive when failure is detected and reported (using enclosure services messages) via the SCSI bus. An application or RAID controller detects a drive-related problem that indicates a data risk. In response, it removes the drive from service and sends a spin-down SCSI command to the drive. This decreases the likelihood that the drive will be damaged during removal from the hot-swap drive bay. When a new drive is Revision 1.31 53

Section	Page
Introduction	13
1.1 Intel® Server Chassis SC5300 Design Features	13
1.2 Intel® Server Chassis SC5300BASE Summary	15
1.3 Intel® Server Chassis SC5300BRP Summary	16
1.4 Intel® Server Chassis SC5300LX Summary	16
2. Chassis Features	18
2.1 Chassis Dimensions and Weight	18
System Colors	18
2.2.1 Pedestal and Rack Mount Features	18
2.3 Security	19
2.4 I/O Panel	19
2.5 Standard and Optional Hot Swap Drive Bays	20
2.6 5.25-inch Half-height Peripheral Bays	20
2.7 Chassis Views	21
3. Chassis Power Subsystem	23
3.1 600-W Power Supply	23
3.1.1 Mechanical Outline	23
3.1.2 Output Wire Harness	24
3.1.2.1 Baseboard power connector (P1)	27
3.1.2.2 Processor Power Connector (P2)	27
3.1.2.3 Power Signal Connector (P13)	28
3.1.2.4 Peripheral Power Connectors (P3, P4, and P6, P8 – P11)	28
3.1.2.5 Floppy Power Connector (P6)	29
3.1.2.6 PCI Express Connector (P15)	29
3.1.3 600-W Power Supply Airflow and Temperature Rise	29
3.1.4 AC Specifications	29
3.1.4.1 AC Inlet Connector	30
3.1.4.2 AC Input Voltage Specification	30
3.1.4.3 Efficiency	30
3.1.4.4 AC Line Dropout / Holdup	30
3.1.4.5 AC Line Fuse	30
3.1.5 600-W DC Output Specifications	31
3.1.5.1 Grounding	31
3.1.5.2 Output Voltage and Currents	31
3.1.5.3 Voltage Regulation	32
3.1.5.4 Standby Operation	32
3.1.6 600-W Protection Circuits	32
3.1.6.1 Over Voltage Protection	33
3.1.6.2 Over Temperature Protection	33
3.1.7 600-W Power Supply Control and Indicator Functions	33
3.1.7.1 PSON# Input Signal	33
3.1.7.2 PWOK (Power OK) Output Signal	33
3.1.8 Mean Time Between Failures (MTBF)	33
3.2 730-W Power Supply	33
3.2.1 730W Power Supply Mechanical Outline	34
3.2.2 Output Wire Harness	35
3.2.3 Airflow Requirements and Temperature Rise	35
3.2.4 AC Specifications	35
3.2.4.1 AC Input Voltage Specification	35
3.2.4.2 Efficiency	35
3.2.4.3 AC Line Fuse	36
3.2.5 730-W DC Specifications	36
3.2.5.1 Output Module Edge Connector	36
3.2.5.2 Output Power / Currents	37
3.2.5.3 Standby Outputs	37
3.2.5.4 Stand By Operation	38
3.2.5.5 Voltage Regulation	38
3.2.6 730-W Protection Circuits	38
3.2.6.1 Over Current Protection	38
3.2.6.2 Over Voltage Protection and Over Temperature	38
3.2.7 730-W Power Supply Control and Indicator Functions	39
3.2.7.1 PSON# Input Signal	39
3.2.7.2 PWOK Output Signal	39
3.2.7.3 PSKILL Signal Requirements	39
3.2.8 730-W Mean Time Between Failure (MTBF)	39
3.2.9 Redundant (1+1) Hot Swap Mode	39
3.3 730-W Power Distribution Board	39
3.3.1 Power Distribution Mechanical Overview	40
3.3.2 Temperature Operational Limits	42
3.3.3 Electrical Specification	42
3.3.3.1 Input Connectors	42
3.3.3.2 Baseboard Power Connector (P1)	43
3.3.3.3 Processor Power Connector (P2)	44
3.3.3.4 Peripheral Power Connectors (P3 - P5, P7 - P12)	44
3.3.3.5 Floppy Power Connector (P6)	44
3.3.3.6 Power Signal Connector P13	45
3.3.3.7 12V Output Load Requirements	45
3.3.3.8 DC/DC Converters Loading	46
3.3.3.9 Voltage Regulation	46
3.3.3.10 Fan-less Operation in Stand-by Mode	47
3.3.4 Protection Circuits	47
3.3.4.1 Over Current Protection (OCP) / 240VA Current Limit	47
3.3.4.2 Over Voltage Protection (OVP)	47
3.3.5 Control and Indicator Functions	47
3.3.5.1 PSON# Input and Output Signals	48
3.3.5.2 PSKILL	48
3.3.5.3 PWOK (Power OK) Input and Output Signals	48
3.3.5.4 lert# Output Signal	48
3.4 SMBus Monitoring Interface	48
3.4.1 Mean Time Between Failures (MTBF)	49
4. System Cooling	50
4.1 Fan Configuration	50
4.1.1 Processor Passive Heat Sink Cooling Solution	50
4.1.2 Base Cooling Solution	51
4.1.2 Redundant Cooling Solution	51
4.2 Fan Control	53
4.3 FAN Header Connector Descriptions	53
5. Hard Disk Drive Bays	54
5.1 Server Chassis SC5300 4HDD and 6HDD SCSI HSBP Overview	54
5.1.1 SCSI Enclosure Management Controller	54
5.1.2 SCSI Interface	55
5.1.2.1 I2C Serial Bus Interface	55
5.1.2.2 Temperature Sensor	55
5.1.2.3 Serial EEPROM	55
5.1.3 External Memory Device	55
5.1.4 Hot Swap Power Controller	55
5.1.5 SCSI Drive Connectors	55
5.1.6 Power Connectors	56
5.1.7 SCA2 SCSI Connector	56
5.1.8 68-Pin SCSI Connector	57
5.1.9 IPMB (I2C) Header	59
5.1.10 Power Budget	59
5.1.11 Hard Drive Activity and Fault LED	59
5.1.12 SCSI Backplane Status LEDs.	60
5.1.13 SCSI Hot Swap Drive Bay Upgrade Kits	62
5.2 SATA/SAS Hot Swap Backplane	62
5.2.1 Enclosure Management Controller	64
5.2.2 SATA/SAS Interface	64
5.2.3 I2C Serial Bus Interface	64
5.2.3.1 I2C Bus Address and Loading	65
5.2.3.2 Temperature Sensor	66
5.2.3.3 Serial EEPROM	66
5.2.4 General Purpose Input/Output (GPIO)	66
5.2.5 External Memory Device	68
5.2.6 LEDs	68
5.2.7 SATA/SAS Drive Connectors	68
5.2.8 Power Connectors	69
5.2.9 Clock Generation and Distribution	69
5.2.10 7-Pin SATA/SAS Connector – Drive0-Drive5	70
5.2.11 IPMB Header - IPMB	70
5.2.12 SATA/SAS Host I2C Header - I2C_1	71
5.2.13 Power Budget	71
5.2.14 Board Layout	71
5.2.15 Connector Specifications	72
5.2.16 SATA/SAS Hot Swap Drive Cage Upgrade Kit	73
6. Front Panel	74
6.1 Front Panel Board Layout	74
6.1.1 Front Panel Connectors	74
6.1.2 Front panel JP2 Header (17x2) Pin-out.	75
6.1.3 I2C Connectors at J1 and J2 (Not Installed) Pin-out	76
6.1.4 Front Panel Controls and Indicators	76
6.2 Chassis Interconnect	79
6.3 Chassis Internal Cables	80
6.3.1 Front Panel Cable	80
6.3.2 USB Cable and Connectors	81
6.3.3 Hot Swap Fan Cables and Connectors	81
6.3.4 SCSI Cable	83
6.3.5 Serial Cable	84
6.3.6 SATA Cable	84
6.3.7 IPMB cable for 6-Drive Bays (4-pin)	85
6.3.8 I2C Cable for 6-Drive Bays (3-pin)	85
7. System-Compatible Server Boards	86
8. Upgrade Accessories	87
8.1 AXX6SCSIDB and AXX4SCSIDB Hot Swap SCSI Drive Bays	87
8.2 SATA/SAS Hot Swap Drive Bay Upgrade Accessory AXX6SASDB	87
8.3 External SCSI Adapter Cable AXXEXTSCSICBL	87
8.4 Rack Conversion Kit ARIGRACK	87
9. Reliability, Serviceability, and Availability	88
9.1 MTBF	88
9.2 Serviceability	88
10. Environmental Limits	90
10.1 System Office Environment	90
10.2 System Environmental Testing	90
11. Product Regulatory Compliance	91
11.1 Product Safety Compliance	91
11.2 Product EMC Compliance	91
11.3 Product Regulatory Compliance Markings	91
11.4 Electromagnetic Compatibility Notices	92
11.4.1 USA	92
11.4.2 FCC Verification Statement	93
11.4.3 ICES-003 (Canada)	93
11.4.4 Europe (CE Declaration of Conformity)	93
11.4.5 Japan EMC Compatibility	93

Match case Limit results 1 per page

Intel® Server Chassis SC5300 5U Kit TPS

Hard Disk Drive Bays

Revision 1.31

Hard Disk Drive Bays

5.1

Server Chassis SC5300 4HDD and 6HDD SCSI HSBP Overview

The Server Chassis SC5300 4HDD or 6HDD SCSI Hot Swap Backplane (HSBP) is a monolithic

printed circuit board. The architecture is based on the QLogic

GEM359 enclosure management

controller and has support for up to 4 or 6 SCSI drives.

The 4HDD and 6HDD SCSI HSBP supports the following feature set:

•

QLogic

GEM359 enclosure management controller

External non-volatile Flash ROM

Two I

C interfaces

Low Voltage Differential (LVD) SCSI Interface

SCSI-3 compatible

Compliance with SCSI Accessed Fault Tolerant Enclosures (SAF-TE) specification,

version 1.00 and addendum

Compliance with Intelligent Platform Management Interface (IPMI)

•

Support for up to 4 or 6 each U320 LVD SCSI Drives

Onboard LVD SCSI Termination

•

Hot Swap Power Controller

•

Temperature Sensor

•

FRU EEPROM

•

Two 4-pin Standard HD Power Connectors

5.1.1

SCSI Enclosure Management Controller

The QLogic

GEM359 is an enclosure management controller for the SCSI backplanes and

monitors various aspects of a storage enclosure.

The chip provides in-band SAF-TE and SES

management through the SCSI interface.

The GEM359 also supports the IPMI specification by

providing management data to a baseboard management controller through the IPMB.

The hot-swap SCSI backplane board set resides in the hot swap drive bay, which is included

with the 650-W redundant chassis and/or is available as an upgrade.

The SCSI interface on the LVD SCSI backplane provides the link between the SCSI bus and the

SCSI Accessed Fault Tolerant Enclosure (SAF-TE) controller. The SAF-TE interface allows the

enclosure management controller to respond as a SCSI target to implement the SAF-TE

protocol.

Power control on the LVD SCSI backplane supports the following features.

•

Spin-down of a drive when failure is detected and reported (using enclosure services

messages) via the SCSI bus.

An application or RAID controller detects a drive-related

problem that indicates a data risk.

In response, it removes the drive from service and

sends a spin-down SCSI command to the drive.

This decreases the likelihood that the

drive will be damaged during removal from the hot-swap drive bay.

When a new drive is