Intel SE7525RP2 Product Specification - Page 11

Introduction

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Intel® Server Board SE7320EP2 / Intel® Server Board SE7525RP2 TPS Introduction 1. Introduction The Intel® Server Board SE7320EP2 / SE7525RP2 Technical Product Specification provides technical details for the server board's functional architecture and feature set. It also provides a high-level detail of some of the board's functional sub-systems. This document is intended to be the technical reference for this board. Updates to this document will be made via the Specification Update that is published monthly following the date of the product launch. 1.1 Server Board Use Disclaimer Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Revision 1.0 11 Intel order number D24635-001

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Intel® Server Board SE7320EP2 / Intel® Server Board SE7525RP2 TPS
Introduction
Revision 1.0
Intel order number D24635-001
11
1.
Introduction
The
Intel® Server Board SE7320EP2 / SE7525RP2 Technical Product Specification
provides
technical details for the server board’s functional architecture and feature set. It also provides a
high-level detail of some of the board’s functional sub-systems.
This document is intended to be the technical reference for this board. Updates to this
document will be made via the Specification Update that is published monthly following the date
of the product launch.
1.1
Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.