LG KU580 Service Manual - Page 33

3. Technical Brief The low-frequency clock is always present, in some applications even when the chipset is powered down. F. STLC2590C • WFBGA 5.0 x 7.5 x 0.8 mm lead-free/RoHs compliant 100 pins • External component: B-BPF (Bluetooth) • PCB footprint < 45mm2 • Based on Ericsson Technology Licensing Baseband Core (EBC) • Bluetooth™ specification compliance: V2.0 + EDR. - Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability - Support ACL and SCO links - Extended SCO (eSCO) links - Faster Connection • HW support for packet types - ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1, 3-DH3, 3-DH5 - SCO: HV1, HV3 and DV - eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5 - Adaptive Frequency Hopping (AFH) • Transmit Power - Power Class 2 and Power Class 1.5 (above 4dBm) - Programmable output power - Power Class 1 compatible • HCI - HCI H4 Transport Layer - HCI proprietary commands (e.g. peripherals control) - Single HCI command for patch/upgrade download • Supports Pitch-Period Error Concealment (PPEC) • Efficient and flexible support for WLAN coexistence in collocated scenario • Low power consumption - Ultra low power architecture with 3 different low-power levels - Deep Sleep modes, including Host power saving feature - Dual Wake-up mechanism: initiated by the Host or by the Bluetooth device • Communication interfaces - Fast UART up to 4Mbit/s - SPI interface - PCM interface - Up to 10 additional flexibly programmable GPIOs - External interrupts possible through the GPIOs - Fast master I2C interface LGE Internal Use Only - 34 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes