Fujitsu MAF3364LC Manual/User Guide - Page 63

VCM/SPM Driver, Read channel LSI

Page 63 highlights

(3) Environmental temperature Temperature condition at installed in a cabinet is indicated with ambient temperature measured 3 cm from the disk drive. At designing the system cabinet, consider following points. • Make a suitable air flow so that the DE surface temperature does not exceed 55°C. CAUTION Heat An air flow with an adequate wind velocity must be maintained to deal with much heat generated from the MAF3364xx. Reference value: An air flow with a wind velocity of more than 0.5 m/s is required in an environment at 40°C, and an air flow with a wind velocity of more than 1.0m/s in an environment at 45°C (Center of DE cover 55°C). • Cool the PCA side especially with air circulation inside the cabinet. Confirm the cooling effect by measuring temperature of specific ICs and the DE. These measurement results should be within a criteria listed in Table 4.1. Table 4.1 Surface temperature check point No. Measurement point 1 Center of DE cover 2 Read channel LSI 3 VCM/SPM Driver 4 HDC 4 1 Criteria 55°C 83°C 75°C 85°C 15/16 CN1 CN2 1/2 2 3 Figure 4.10 Surface temperature measurement points (MAF series, MAE series, MAG series) 4 - 10 C141-E064-03EN

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C141-E064-03EN
4 - 10
(3)
Environmental temperature
Temperature condition at installed in a cabinet is indicated with ambient temperature measured
3 cm from the disk drive.
At designing the system cabinet, consider following points.
Make a suitable air flow so that the DE surface temperature does not exceed 55°C.
CAUTION
Heat
An air flow with an adequate wind velocity must be maintained to
deal with much heat generated from the MAF3364xx.
Reference value:
An air flow with a wind velocity of more than
0.5 m/s is required in an environment at 40°C,
and an air flow with a wind velocity of more
than 1.0m/s in an environment at 45°C (Center
of DE cover 55°C).
Cool the PCA side especially with air circulation inside the cabinet.
Confirm the cooling
effect by measuring temperature of specific ICs and the DE.
These measurement results
should be within a criteria listed in Table 4.1.
Table 4.1
Surface temperature check point
No.
Measurement point
Criteria
1
Center of DE cover
55°C
2
Read channel LSI
83°C
3
VCM/SPM Driver
75°C
4
HDC
85°C
Figure 4.10
Surface temperature measurement points (MAF series, MAE series, MAG series)
4
3
1/2
15/16
CN2
CN1
2
1