HP Latex 110 Users Guide - Page 10

Heat hazard, Fire hazard, Mechanical hazard, Do not attempt to dismantle or modify the curing modules.

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● Do not remove or open any other closed system covers or plugs. ● Do not insert objects through slots in the printer. Heat hazard The curing subsystems of the printer operate at high temperatures and can cause burns if touched. To avoid personal injury, take the following precautions. ● Do not touch the internal enclosures of the printer's curing zones. ● Let the printer cool down when accessing the internal curing zone and output platen in case of a substrate jam. ● Let the printer cool down before performing some maintenance operations. Fire hazard The curing subsystems of the printer operate at high temperatures. To avoid the risk of fire, take the following precautions. ● The customer is responsible for meeting the printer's requirements and the Electrical Code requirements according to the local jurisdiction of the country where the equipment is installed. Use the power supply voltage specified on the nameplate. ● Connect the power cords to dedicated lines, each protected by a branch circuit breaker according to the information detailed in the site preparation guide. Do not use a power strip (relocatable power tap) to connect both power cords. ● Use only the power cords supplied by HP with the printer. Do not use a damaged power cord. Do not use the power cords with other products. ● Do not insert objects through slots in the printer. ● Take care not to spill liquid on the printer. After cleaning, make sure all components are dry before using the printer again. ● Do not use aerosol products that contain flammable gases inside or around the printer. Do not operate the printer in an explosive atmosphere. ● Do not block or cover the openings of the printer. ● Do not attempt to dismantle or modify the curing modules. ● Ensure that the operating temperature of the substrate recommended by the manufacturer is not exceeded. If this information is not available, ask the manufacturer. Do not load substrates that cannot be used at an operating temperature above 125°C (257°F). ● Do not load substrates with auto-ignition temperatures below 250°C (482°F). If this information is not available, printing must be supervised at all times. See note below. NOTE: Test method based on EN ISO 6942:2002; Evaluation of materials and material assemblies when exposed to a source of radiant heat, method B. The test conditions, to determine the temperature when the substrate starts ignition (either flame or glow), were: Heat flux density 30 kW/m², copper calorimeter, K type thermocouple. Mechanical hazard The printer has moving parts that could cause injury. To avoid personal injury, take the following precautions when working close to the printer. 4 Chapter 1 Introduction ENWW

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●
Do not remove or open any other closed system covers or plugs.
●
Do not insert objects through slots in the printer.
Heat hazard
The curing subsystems of the printer operate at high temperatures and can cause burns if touched. To avoid
personal injury, take the following precautions.
●
Do not touch the internal enclosures of the printer's curing zones.
●
Let the printer cool down when accessing the internal curing zone and output platen in case of a
substrate jam.
●
Let the printer cool down before performing some maintenance operations.
Fire hazard
The curing subsystems of the printer operate at high temperatures.
To avoid the risk of fire, take the following precautions.
●
The customer is responsible for meeting the printer's requirements and the Electrical Code
requirements according to the local jurisdiction of the country where the equipment is installed. Use the
power supply voltage specified on the nameplate.
●
Connect the power cords to dedicated lines, each protected by a branch circuit breaker according to the
information detailed in the site preparation guide. Do not use a power strip (relocatable power tap) to
connect both power cords.
●
Use only the power cords supplied by HP with the printer. Do not use a damaged power cord. Do not use
the power cords with other products.
●
Do not insert objects through slots in the printer.
●
Take care not to spill liquid on the printer. After cleaning, make sure all components are dry before
using the printer again.
●
Do not use aerosol products that contain flammable gases inside or around the printer. Do not operate
the printer in an explosive atmosphere.
●
Do not block or cover the openings of the printer.
●
Do not attempt to dismantle or modify the curing modules.
●
Ensure that the operating temperature of the substrate recommended by the manufacturer is not
exceeded. If this information is not available, ask the manufacturer. Do not load substrates that cannot
be used at an operating temperature above 125°C (257°F).
●
Do not load substrates with auto-ignition temperatures below 250°C (482°F). If this information is not
available, printing must be supervised at all times. See note below.
NOTE:
Test method based on EN ISO 6942:2002;
Evaluation of materials and material assemblies when
exposed to a source of radiant heat, method B
. The test conditions, to determine the temperature when the
substrate starts ignition (either flame or glow), were: Heat flux density 30 kW/m², copper calorimeter, K type
thermocouple.
Mechanical hazard
The printer has moving parts that could cause injury. To avoid personal injury, take the following precautions
when working close to the printer.
4
Chapter 1
Introduction
ENWW