HP Pavilion dv6-6000 HP Pavilion dv6 Notebook PC - Maintenance and Service Gui - Page 93

A thermal pad is used on the graphics subsystem chip, that services

Get HP Pavilion dv6-6000 PDF manuals and user guides View all HP Pavilion dv6-6000 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 93 highlights

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the fan/heat sink assembly is removed. Replacement thermal material is included with the fan/heat sink assembly, processor, and system board spare part kits. Replacement thermal material is also available in the Thermal Material Kit. NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it (only on computer models equipped with a graphics subsystem with discrete memory) ● A thermal pad is used on the Northbridge chip (5) and the heat sink section (6) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it (only on computer models equipped with a graphics subsystem with discrete memory) ● A thermal pad is used on the Northbridge chip (5) and the heat sink section (6) that services it Component replacement procedures 85

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the fan/heat sink assembly is removed. Replacement thermal material is
included with the fan/heat sink assembly, processor, and system board spare part kits.
Replacement thermal material is also available in the Thermal Material Kit.
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an AMD processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it (only on computer models equipped with a graphics subsystem with discrete memory)
●
A thermal pad is used on the Northbridge chip
(5)
and the heat sink section
(6)
that services it
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it (only on computer models equipped with a graphics subsystem with discrete memory)
●
A thermal pad is used on the Northbridge chip
(5)
and the heat sink section
(6)
that services it
Component replacement procedures
85