HP Pavilion dv7-7100 HP Pavilion g6 Notebook PC - Maintenance and Service Guid - Page 77

that services it, Thermal paste is used on the processor

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4. Remove the fan and heat sink (4). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it (only on computer models equipped with a graphics subsystem with discrete memory) Component replacement procedures 69

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4.
Remove the fan and heat sink
(4)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the heat sink is removed. Replacement
thermal material is included with the base enclosure, heat sink, processor, and system board
spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it (only on computer models equipped with a graphics subsystem with
discrete memory)
Component replacement procedures
69