HP ProLiant BL660c Electrical signal integrity considerations for HP BladeSyst - Page 1
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Electrical signal integrity considerations for HP BladeSystem technology brief Introduction...2 What is signal integrity ...2 Challenges...4 Significant factors affecting signal integrity 6 Dielectric losses ...6 Skin effect ...6 Impedance discontinuities ...6 Stubs ...7 Crosstalk...8 Design goals ...9 Target fabrics ...10 Infrastructure architecture ...10 Implementation ...11 Specification library ...12 Board trace lengths ...12 Board layout and materials ...12 Summary ...15 For more information...16 Call to action ...16
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Electrical signal integrity considerations for
HP BladeSystem
technology brief
Introduction
.........................................................................................................................................
2
What is signal integrity
........................................................................................................................
2
Challenges
..........................................................................................................................................
4
Significant factors affecting signal integrity
.............................................................................................
6
Dielectric losses
...............................................................................................................................
6
Skin effect
.......................................................................................................................................
6
Impedance discontinuities
.................................................................................................................
6
Stubs
..............................................................................................................................................
7
Crosstalk
.........................................................................................................................................
8
Design goals
.......................................................................................................................................
9
Target fabrics
................................................................................................................................
10
Infrastructure architecture
................................................................................................................
10
Implementation
..................................................................................................................................
11
Specification library
.......................................................................................................................
12
Board trace lengths
........................................................................................................................
12
Board layout and materials
.............................................................................................................
12
Summary
..........................................................................................................................................
15
For more information
..........................................................................................................................
16
Call to action
....................................................................................................................................
16