HP ProLiant BL660c Electrical signal integrity considerations for HP BladeSyst - Page 15

Summary

Page 15 highlights

Summary The BladeSystem c-Class enclosure was designed to ensure that it could support new high-speed technologies and their demand for both bandwidth and power for at least 5 to 7 years. Signal integrity issues arise as transmission frequencies increase. These issues require specific engineering to ensure that electronic circuits communicate reliably in the presence of signal impairments. This increased complexity has created a need for development of design guidelines and created a requirement for strict adherence to the resultant guidelines. The design must leverage industry standard components and interoperate with the dozens of companies and multiple divisions involved. HP has substantially engaged in signal integrity engineering to guarantee success and manage costs effectively. The effort modularized the system into its component parts, created and applied significant modeling/simulation techniques, and then verified, through empirical data, that the models accurately reflected the physical system. HP created and maintains an extensive documentation/specification library that with adherence yields design success and customer satisfaction. 15

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Summary
The BladeSystem c-Class enclosure was designed to ensure that it could support new high-speed
technologies and their demand for both bandwidth and power for at least 5 to 7 years.
Signal integrity issues arise as transmission frequencies increase. These issues require specific
engineering to ensure that electronic circuits communicate reliably in the presence of signal
impairments. This increased complexity has created a need for development of design guidelines and
created a requirement for strict adherence to the resultant guidelines. The design must leverage
industry standard components and interoperate with the dozens of companies and multiple divisions
involved.
HP has substantially engaged in signal integrity engineering to guarantee success and manage costs
effectively. The effort modularized the system into its component parts, created and applied significant
modeling/simulation techniques, and then verified, through empirical data, that the models accurately
reflected the physical system. HP created and maintains an extensive documentation/specification
library that with adherence yields design success and customer satisfaction.
15