HP ProLiant BL660c HP BladeSystem c-Class architecture
HP ProLiant BL660c Manual
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HP ProLiant BL660c manual content summary:
- HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 1
16 Signal midplane provides reliability 17 Power backplane scalability and reliability 18 Power and cooling architecture with HP Thermal Logic 18 Server blades and processors ...19 Enclosure ...19 Meeting data center configurations 19 High-efficiency voltage conversions 19 Dynamic Power - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 2
Reduced logistical delay time ...26 Conclusion...26 For more information...27 Call to action ...28 - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 3
enclosure http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01204885/c01204885.pdf • HP BladeSystem c-Class server blades-describes the architecture and implementation of major technologies in HP ProLiant c-Class server blades; including processors, memory, connections, power, management, and - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 4
servers are deployed • Server virtualization tools that would also affect processor, memory, and I/O configurations per server HP supports multiple high-speed fabrics in a protocol-agnostic manner, so administrators can populate the enclosure with server blades and interconnect modules in many ways - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 5
server, storage, or I/O option blades. Figure 1. HP BladeSystem c7000 Enclosure as viewed from the front and the rear c7000 enclosure - front Half-height server blade Full-height server blade Storage blade .www2.hp.com/bc/docs/support/SupportManual/c00816246/c00816246.pdf. The HP BladeSystem - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 6
enclosure holding up to eight blades, to a rack containing seven enclosures holding up to 56 server, storage, or option blades total. Figure 2. HP BladeSystem c3000 enclosure (rack-model) as viewed from the front and the rear Figure 3. HP BladeSystem c3000 enclosure (tower model) as viewed from the - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 7
-purpose infrastructure that can support many different options of server blades, storage blades, and interconnect devices. BladeSystem c-Class supports ProLiant server blades using AMD or Intel x86 processors, Integrity IA-64 server blades, StorageWorks storage blades, and interconnect modules that - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 8
HP configuration using wider device bays offers several advantages: • Supports commodity performance components for reduced cost, while housing a sufficient number of blades the use of standard-height dual inline memory modules (DIMMs) in the server blades for cost effectiveness. • Provides improved - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 9
weighing memory capacity, power use, and cost. Interconnect form factors HP selected modules and blades • Optimized form factors for supporting the maximum number of interconnect topology that provides more bandwidth to each of the server blades. When using a double-wide module, redundant connections - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 10
midplane provides flexibility The BladeSystem c-Class uses a high-speed, NonStop signal midplane that provides the flexibility to intermingle blades and interconnect fabrics in many ways to solve a multitude of application needs. The NonStop signal midplane is unique because it can use the same - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 11
signal midplane can support either network-semantic protocols (such as Ethernet, Fibre Channel, and InfiniBand) or memory-semantic protocols manner avoids the problems of having to replicate traces to support each type of fabric on the NonStop signal midplane or of having large numbers of signal - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 12
and 2. Figure 9 gives an example of how c-Class half-height server blades connect to the interconnect bays in the c3000 enclosure. Customers should review the appropriate user guide for each enclosure. The guides are available at http://h71028.www7.hp.com/enterprise/cache/316682-0-0-0-121.html. 12 - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 13
in the c7000 to the interconnect bays Figure 9. Connection of c-Class half-height server blades in the c3000 enclosure to the interconnect bays. To provide such inherent flexibility of the NonStop signal midplane, the architecture must provide a mechanism to properly - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 14
an adjacent server blade. These possibilities exist because the NonStop signal midplane can carry either network-semantic traffic or memory-semantic traffic the full-height configuration, HP server blades can support approximately twice the resources of a half-height server blade: for example, up to - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 15
server blades, see the technology brief titled "HP ProLiant c-Class server blades," available at http://h20000.www2.hp.com/bc/docs/support losses • Routing signals in groups to minimize signal skew • Reducing the number of through-hole via stubs by carefully selecting the layers to route the - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 16
interface controllers (NICs). As shown in Figure 11, the topology for Device 1 on server blade 1 (a-b-c) is completely different than the topology for device 1 on server blade 4 (a-d-e). Therefore, an electronic keying mechanism in the Onboard Administrator identifies the channel topology for - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 17
different emphasis settings Server blade-1 a DEV-1 Midplane b PCB Switch-1 PCB c Switch e Device Server blade-4 a d DEV Erasable Programmable Read-Only Memory (EEPROM), which the Onboard Administrator uses to acquire information such as the midplane serial number. If this device were - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 18
pins for the server blades Power delivery HP consolidated power and cooling resources, while efficiently sharing and managing them within the enclosure. HP specific configuration of each blade in the enclosure. As blades are inserted into the enclosure, the Onboard Administrator discovers each blade - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 19
space for full-size memory modules and hot plug hard drives on the server blades. Most importantly, c-Class server blades incorporate intelligent management processors (Integrated Lights-Out 2, or iLO 2, for ProLiant server blades, or Integrity iLO for Integrity server blades) that provide detailed - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 20
specific areas. Because such fans generate fairly low flow (in cubic feet per minute, or CFM) at medium back pressure, a single server often requires multiple fans to ensure adequate cooling. Therefore, when many server blades solutions in mind, HP solved these problems by designing the Active - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 21
these technologies. They are available on the HP technology website: www.hp.com/servers/technology. Integrated Lights-out technology Each ProLiant server blade designed for the BladeSystem c-Class includes an iLO 2 management processor. The iLO 2 processor monitors thermal and operational conditions - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 22
flexibility in allowing customers to configure the system in virtually any way they desire. To assist in the configuration and setup process for the IT administrator, the Onboard Administrator verifies four attributes for each server blade and interconnect module as they are added to the enclosure - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 23
WWN addresses with the addresses created in the server-specific I/O profile. These profiles are managed locally. If any changes need to occur (for instance, if a server blade needs to be upgraded), the system administrator can swap out the server blade, and the Virtual Connect Manager will manage - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 24
are physically connected to the same network. The single resource pool and capability to group large numbers of servers enables rapid, reliable deployment and movement of servers across the datacenter. More information about Virtual Connect Enterprise Manager is available at www.hp.com/go/vcem. 24 - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 25
page 10. And the c7000 enclosure is capable of supporting either one or two Onboard Administrator modules in an server blades are designed with ample room for intake air and heat sinks (both on the processor and memory modules). Rather than use the traditional heat sink design for the processors, HP - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 26
are made to a pool of server blades, it is quick and easy to migrate the network service from a failed server blade to a functional server blade. Finally, the fans, power supplies, interconnect modules, Onboard Administrator modules, server blades, and storage blades are hot-pluggable, meaning that - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 27
the HP BladeSystem c-Class ƒ HP ProLiant c-Class Server Blades ƒ HP BladeSystem c-Class SAN connectivity HP Labs technical report: Blades as a General-Purpose Infrastructure for Future System Architectures: Challenges and Solutions http://h18000.www1.hp.com/products/servers/management /ilo/power - HP ProLiant BL660c | HP BladeSystem c-Class architecture - Page 28
Call to action Send comments about this paper to [email protected]. © Copyright 2006, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements
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HP BladeSystem c-Class architecture
technology brief, 2nd edition
Abstract
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3
Evaluating requirements for next-generation server and storage blades
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4
HP BladeSystem c-Class architecture overview
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4
Component overview
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5
General-purpose compute solution
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7
Physically scalable form factors
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7
Blade form factors
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7
Interconnect form factors
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9
Star topology
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9
NonStop signal midplane provides flexibility
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10
Physical layer similarities among I/O fabrics
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10
Connectivity between blades and interconnect modules
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12
NonStop signal midplane enables modularity
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14
BladeSystem c-Class architecture provides high bandwidth and compute performance
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14
Server-class components
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14
NonStop signal midplane scalability
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15
Best practices
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15
Separate power backplane
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16
Channel topology and emphasis settings
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16
Signal midplane provides reliability
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17
Power backplane scalability and reliability
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18
Power and cooling architecture with HP Thermal Logic
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18
Server blades and processors
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19
Enclosure
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19
Meeting data center configurations
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19
High-efficiency voltage conversions
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19
Dynamic Power Saver Mode
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20
Active Cool fans
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20
PARSEC architecture
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20
Configuration and management technologies
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21
Integrated Lights-out technology
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21
Onboard Administrator
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21
Virtualized network infrastructure with Virtual Connect technology
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23
Availability technologies
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25
Redundant configurations
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25
Reliable components
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25