HP ProLiant BL660c HP BladeSystem c-Class architecture - Page 1

HP BladeSystem c-Class architecture technology brief, 2nd edition Abstract...3 Evaluating requirements for next-generation server and storage blades 4 HP BladeSystem c-Class architecture overview 4 Component overview ...5 General-purpose compute solution ...7 Physically scalable form factors...7 Blade form factors ...7 Interconnect form factors ...9 Star topology ...9 NonStop signal midplane provides flexibility 10 Physical layer similarities among I/O fabrics 10 Connectivity between blades and interconnect modules 12 NonStop signal midplane enables modularity 14 BladeSystem c-Class architecture provides high bandwidth and compute performance 14 Server-class components ...14 NonStop signal midplane scalability 15 Best practices...15 Separate power backplane ...16 Channel topology and emphasis settings 16 Signal midplane provides reliability 17 Power backplane scalability and reliability 18 Power and cooling architecture with HP Thermal Logic 18 Server blades and processors ...19 Enclosure ...19 Meeting data center configurations 19 High-efficiency voltage conversions 19 Dynamic Power Saver Mode...20 Active Cool fans...20 PARSEC architecture ...20 Configuration and management technologies 21 Integrated Lights-out technology ...21 Onboard Administrator...21 Virtualized network infrastructure with Virtual Connect technology 23 Availability technologies...25 Redundant configurations...25 Reliable components...25