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Intel KD875PBZLKPAK10 Product Specification - Page 113

Burn-In Mode Submenu, CAUTION

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BIOS Setup Program 4.4.9.1 Burn-In Mode Submenu To access this menu, select Advanced on the menu bar, then Chipset Configuration, and then Burn-In Mode. Maintenance Main Advanced Security Power PCI Configuration Boot Configuration Peripheral Configuration Drive Configuration Floppy Configuration Event Log Configuration Video Configuration USB Configuration Chipset Configuration Burn-In Mode Fan Control Configuration Hardware Monitoring Boot Exit The submenu represented in Table 63 is for configuring Burn-In Mode options. Table 63. Burn-In Mode Submenu Feature Options Do you wish to continue? • No (default) • Continue Host and I/O Burn-In Mode AGP/PCI Burn-In Mode • Default (default) • -2.0% • -1.0% • +1.0% • +2.0% • +3.0% • +4.0% • Default (default) • 63.88/31.94 MHz • 68.05/34.02 MHz • 69.44/34.72 MHz • 70.83/35.41 MHz • 72.22/36.11 MHz • 73.60/36.80 MHz Description Enables or disables setting of burn-in mode options. Burn-in Mode is an unsupported capability for use by system engineers and technicians for validation and test purposes. Alters the host clock (system bus) and I/O clocks (AGP and PCI) by the percentage selected. If this option is set to anything other than Default, the AGP/PCI Burn-In Mode (shown below) is automatically set to Default. Enables the selection of specific AGP/PCI clock frequencies. The host clock (system bus speed) is not changed. If this option is set to anything other than Default, the Host and I/O Burn-In Mode (shown above) is automatically set to Default. CAUTION These settings are intended for validation and test purposes only. Altering host and I/O clock frequencies may reduce system stability and/or shorten the useful life of the processor. Operation at settings beyond component specification is not covered by Intel component warranties. If any problems occur during operation at non-default settings, return the board to default values. 113

Section	Page
Intel® Desktop Board D875PBZ Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Notes, Cautions, and Warnings	3
Other Common Notation	4
Contents	5
1 Product Description	11
1.1 Overview	12
1.1.1 Feature Summary	12
1.1.2 Manufacturing Options	13
1.1.3 Board Layout	14
1.1.4 Block Diagram	15
1.2 Online Support	16
1.3 Operating System Support	16
1.4 Design Specifications	17
1.5 Processor	20
1.6 System Memory	21
1.6.1 Memory Features	21
1.6.2 Memory Configurations	23
1.7 Intel® 875P Chipset	28
1.7.1 AGP	29
1.7.2 USB	29
1.7.3 IDE Support	30
1.7.4 Real-Time Clock, CMOS SRAM, and Battery	32
1.7.5 Intel® 82802AC Firmware Hub (FWH)	32
1.8 I/O Controller	32
1.8.1 Serial Port	33
1.8.2 Parallel Port	33
1.8.3 Diskette Drive Controller	33
1.8.4 Keyboard and Mouse Interface	33
1.9 Audio Subsystem (Optional)	34
1.9.1 Audio Subsystem Software	34
1.9.2 Intel Flex 6 Audio Subsystem	34
1.9.3 Audio Connectors	36
1.10 LAN Subsystem	37
1.10.1 LAN Subsystem Software	37
1.10.2 Intel® 82547EI Platform LAN Connect Device	37
1.10.3 RJ-45 LAN Connector with Integrated LEDs	37
1.11 Hardware Management Subsystem	38
1.11.1 Hardware Monitoring and Fan Control ASIC	38
1.11.2 Thermal Monitoring	39
1.11.3 Fan Monitoring	40
1.11.4 Chassis Intrusion and Detection	40
1.12 Power Management	40
1.12.1 ACPI	41
1.12.2 Hardware Support	43
2 Technical Reference	49
2.1 Introduction	49
2.2 Memory Resources	49
2.2.1 Addressable Memory	49
2.2.2 Memory Map	51
2.3 DMA Channels	51
2.4 Fixed I/O Map	52
2.5 PCI Configuration Space Map	53
2.6 Interrupts	54
2.7 PCI Interrupt Routing Map	55
2.8 Connectors	57
2.8.1 Back Panel Connectors	58
2.8.2 Internal I/O Connectors	60
2.8.3 External I/O Connectors	68
2.9 Jumper Blocks	72
2.9.1 Front Panel Audio Connector/Jumper Block	72
2.9.2 BIOS Setup Configuration Jumper Block	73
2.10 Mechanical Considerations	74
2.10.1 D875PBZ Form Factor	74
2.10. 2 I/O Shield	75
2.11 Electrical Considerations	77
2.11.1 DC Loading	77
2.11.2 Add-in Board Considerations	77
2.11.3 Fan Connector Current Capability	77
2.11.4 Power Supply Considerations	78
2.12 Thermal Considerations	79
2.13 Reliability	81
2.14 Environmental	81
2.15 Regulatory Compliance	82
2.15.1 Safety Regulations	82
2.15.2 EMC Regulations	82
2.15.3 European Union Declaration of Conformity Statement	83
2.15.4 Product Ecology Statements	83
2.15.5 Product Certification Markings (Board Level)	84
3 Overview of BIOS Features	85
3.1 Introduction	85
3.2 BIOS Flash Memory Organization	85
3.3 Resource Configuration	86
3.3.1 PCI Autoconfiguration	86
3.3.2 PCI IDE Support	86
3.4 System Management BIOS (SMBIOS)	87
3.5 Legacy USB Support	88
3.6 BIOS Updates	88
3.6.1 Language Support	89
3.6.2 Custom Splash Screen	89
3.7 Recovering BIOS Data	89
3.8 Boot Options	90
3.8.1 CD-ROM Boot	90
3.8.2 Network Boot	90
3.8.3 Booting Without Attached Devices	90
3.8.4 Changing the Default Boot Device During POST	91
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot	91
3.9.1 Peripheral Selection and Configuration	91
3.9.2 Intel Rapid BIOS Boot	92
3.10 BIOS Security Features	93
4 BIOS Setup Program	95
4.1 Introduction	95
4.2 Maintenance Menu	96
4.3 Main Menu	97
4.4 Advanced Menu	98
4.4.1 PCI Configuration Submenu	99
4.4.2 Boot Configuration Submenu	100
4.4.3 Peripheral Configuration Submenu	101
4.4.4 Drive Configuration Submenu	103
4.4.5 Floppy Configuration Submenu	107
4.4.6 Event Log Configuration Submenu	108
4.4.7 Video Configuration Submenu	109
4.4.8 USB Configuration Submenu	110
4.4.9 Chipset Configuration Submenu	111
4.4.10 Fan Control Configuration Submenu	114
4.4.11 Hardware Monitoring	115
4.5 Security Menu	116
4.6 Power Menu	117
4.6.1 ACPI Submenu	117
4.7 Boot Menu	118
4.7.1 Boot Device Priority Submenu	119
4.7.2 Hard Disk Drives Submenu	120
4.7.3 Removable Devices Submenu	120
4.7.4 ATAPI CD-ROM Drives Submenu	121
4.8 Exit Menu	121
5 Error Messages and Beep Codes	123
5.1 BIOS Error Messages	123
5.2 Port 80h POST Codes	125
5.3 Bus Initialization Checkpoints	129
5.4 Speaker	130

Match case Limit results 1 per page

BIOS Setup Program

113

4.4.9.1

Burn-In Mode Submenu

To access this menu, select Advanced on the menu bar, then Chipset Configuration, and then

Burn-In Mode.

Maintenance

Main

Advanced

Security

Power

Boot

Exit

PCI Configuration

Boot Configuration

Peripheral Configuration

Drive Configuration

Floppy Configuration

Event Log Configuration

Video Configuration

USB Configuration

Chipset Configuration

Burn-In Mode

Fan Control Configuration

Hardware Monitoring

The submenu represented in Table 63 is for configuring Burn-In Mode options.

Table 63.

Burn-In Mode Submenu

Feature

Options

Description

Do you wish to

continue?

•

No (default)

•

Continue

Enables or disables setting of burn-in mode options.

Burn-in Mode is an unsupported capability for use by

system engineers and technicians for validation and

test purposes.

Host and I/O Burn-In

Mode

•

Default (default)

•

–

2.0%

•

–

1.0%

•

+1.0%

•

+2.0%

•

+3.0%

•

+4.0%

Alters the host clock (system bus) and I/O clocks

(AGP and PCI) by the percentage selected.

If this option is set to anything other than

Default

, the

AGP/PCI Burn-In Mode (shown below) is

automatically set to

Default

AGP/PCI Burn-In Mode

•

Default (default)

•

63.88/31.94 MHz

•

68.05/34.02 MHz

•

69.44/34.72 MHz

•

70.83/35.41 MHz

•

72.22/36.11 MHz

•

73.60/36.80 MHz

Enables the selection of specific AGP/PCI clock

frequencies.

The host clock (system bus speed) is

not changed.

If this option is set to anything other than

Default

, the

Host and I/O Burn-In Mode (shown above) is

automatically set to

Default

CAUTION

These settings are intended for validation and test purposes only.

Altering host and I/O clock

frequencies may reduce system stability and/or shorten the useful life of the processor.

Operation

at settings beyond component specification is not covered by Intel component warranties.

If any

problems occur during operation at non-default settings, return the board to default values.