Intel KD875PBZLKPAK10 Product Specification - Page 49

49

2 Technical Reference

What This Chapter Contains

2.1

Introduction

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49

2.2

Memory Resources

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49

2.3

DMA Channels

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51

2.4

Fixed I/O Map

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52

2.5

PCI Configuration Space Map

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53

2.6

Interrupts

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54

2.7

PCI Interrupt Routing Map

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55

2.8

Connectors

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57

2.9

Jumper Blocks

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72

2.10

Mechanical Considerations

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74

2.11

Electrical Considerations

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77

2.12

Thermal Considerations

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79

2.13

Reliability

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81

2.14

Environmental

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81

2.1 Introduction

Sections 2.2 - 2.6 contain several standalone tables.

Table 12 describes the system memory map,

Table 13 lists the DMA channels, Table 14 shows the fixed I/O map, Table 15 defines the PCI

configuration space map, and Table 16 describes the interrupts.

The remaining sections in this

chapter are introduced by text found with their respective section headings.

2.2 Memory Resources

2.2.1

Addressable Memory

The D875PBZ utilizes 4 GB of addressable system memory.

Typically the address space that is

allocated for PCI add-in cards, AGP aperture, BIOS (firmware hub), and chipset overhead resides

above the top of DRAM (total system memory).

On a system that has 4 GB of system memory

installed, it is not possible to use all of the installed memory due to system address space being

allocated for other system critical functions.

These functions include the following:

•

Memory-mapped I/O that is dynamically allocated for PCI and AGP cards

•

AGP aperture

•

APIC and chipset overhead (approximately 18 MB)

•

BIOS/firmware hub (approximately 2 MB)

The amount of installed memory that can be used will vary based on add-in cards and BIOS

settings.

For example, if the PCI cards are requesting 200 MB of system memory and the AGP

aperture is set to 256 MB in the BIOS Setup program, there will be approximately 3.54 GB of

memory that can be accessed.

Figure 15 shows a schematic of the system memory map.

All

Section	Page
Intel® Desktop Board D875PBZ Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Notes, Cautions, and Warnings	3
Other Common Notation	4
Contents	5
1 Product Description	11
1.1 Overview	12
1.1.1 Feature Summary	12
1.1.2 Manufacturing Options	13
1.1.3 Board Layout	14
1.1.4 Block Diagram	15
1.2 Online Support	16
1.3 Operating System Support	16
1.4 Design Specifications	17
1.5 Processor	20
1.6 System Memory	21
1.6.1 Memory Features	21
1.6.2 Memory Configurations	23
1.7 Intel® 875P Chipset	28
1.7.1 AGP	29
1.7.2 USB	29
1.7.3 IDE Support	30
1.7.4 Real-Time Clock, CMOS SRAM, and Battery	32
1.7.5 Intel® 82802AC Firmware Hub (FWH)	32
1.8 I/O Controller	32
1.8.1 Serial Port	33
1.8.2 Parallel Port	33
1.8.3 Diskette Drive Controller	33
1.8.4 Keyboard and Mouse Interface	33
1.9 Audio Subsystem (Optional)	34
1.9.1 Audio Subsystem Software	34
1.9.2 Intel Flex 6 Audio Subsystem	34
1.9.3 Audio Connectors	36
1.10 LAN Subsystem	37
1.10.1 LAN Subsystem Software	37
1.10.2 Intel® 82547EI Platform LAN Connect Device	37
1.10.3 RJ-45 LAN Connector with Integrated LEDs	37
1.11 Hardware Management Subsystem	38
1.11.1 Hardware Monitoring and Fan Control ASIC	38
1.11.2 Thermal Monitoring	39
1.11.3 Fan Monitoring	40
1.11.4 Chassis Intrusion and Detection	40
1.12 Power Management	40
1.12.1 ACPI	41
1.12.2 Hardware Support	43
2 Technical Reference	49
2.1 Introduction	49
2.2 Memory Resources	49
2.2.1 Addressable Memory	49
2.2.2 Memory Map	51
2.3 DMA Channels	51
2.4 Fixed I/O Map	52
2.5 PCI Configuration Space Map	53
2.6 Interrupts	54
2.7 PCI Interrupt Routing Map	55
2.8 Connectors	57
2.8.1 Back Panel Connectors	58
2.8.2 Internal I/O Connectors	60
2.8.3 External I/O Connectors	68
2.9 Jumper Blocks	72
2.9.1 Front Panel Audio Connector/Jumper Block	72
2.9.2 BIOS Setup Configuration Jumper Block	73
2.10 Mechanical Considerations	74
2.10.1 D875PBZ Form Factor	74
2.10. 2 I/O Shield	75
2.11 Electrical Considerations	77
2.11.1 DC Loading	77
2.11.2 Add-in Board Considerations	77
2.11.3 Fan Connector Current Capability	77
2.11.4 Power Supply Considerations	78
2.12 Thermal Considerations	79
2.13 Reliability	81
2.14 Environmental	81
2.15 Regulatory Compliance	82
2.15.1 Safety Regulations	82
2.15.2 EMC Regulations	82
2.15.3 European Union Declaration of Conformity Statement	83
2.15.4 Product Ecology Statements	83
2.15.5 Product Certification Markings (Board Level)	84
3 Overview of BIOS Features	85
3.1 Introduction	85
3.2 BIOS Flash Memory Organization	85
3.3 Resource Configuration	86
3.3.1 PCI Autoconfiguration	86
3.3.2 PCI IDE Support	86
3.4 System Management BIOS (SMBIOS)	87
3.5 Legacy USB Support	88
3.6 BIOS Updates	88
3.6.1 Language Support	89
3.6.2 Custom Splash Screen	89
3.7 Recovering BIOS Data	89
3.8 Boot Options	90
3.8.1 CD-ROM Boot	90
3.8.2 Network Boot	90
3.8.3 Booting Without Attached Devices	90
3.8.4 Changing the Default Boot Device During POST	91
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot	91
3.9.1 Peripheral Selection and Configuration	91
3.9.2 Intel Rapid BIOS Boot	92
3.10 BIOS Security Features	93
4 BIOS Setup Program	95
4.1 Introduction	95
4.2 Maintenance Menu	96
4.3 Main Menu	97
4.4 Advanced Menu	98
4.4.1 PCI Configuration Submenu	99
4.4.2 Boot Configuration Submenu	100
4.4.3 Peripheral Configuration Submenu	101
4.4.4 Drive Configuration Submenu	103
4.4.5 Floppy Configuration Submenu	107
4.4.6 Event Log Configuration Submenu	108
4.4.7 Video Configuration Submenu	109
4.4.8 USB Configuration Submenu	110
4.4.9 Chipset Configuration Submenu	111
4.4.10 Fan Control Configuration Submenu	114
4.4.11 Hardware Monitoring	115
4.5 Security Menu	116
4.6 Power Menu	117
4.6.1 ACPI Submenu	117
4.7 Boot Menu	118
4.7.1 Boot Device Priority Submenu	119
4.7.2 Hard Disk Drives Submenu	120
4.7.3 Removable Devices Submenu	120
4.7.4 ATAPI CD-ROM Drives Submenu	121
4.8 Exit Menu	121
5 Error Messages and Beep Codes	123
5.1 BIOS Error Messages	123
5.2 Port 80h POST Codes	125
5.3 Bus Initialization Checkpoints	129
5.4 Speaker	130

Intel KD875PBZLKPAK10 Product Specification - Page 49

Technical Reference

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