Intel KD875PBZLKPAK10 Product Specification - Page 5

Contents - processors

Page 5 highlights

Contents 1 Product Description 1.1 Overview ...12 1.1.1 Feature Summary 12 1.1.2 Manufacturing Options 13 1.1.3 Board Layout 14 1.1.4 Block Diagram 15 1.2 Online Support ...16 1.3 Operating System Support 16 1.4 Design Specifications 17 1.5 Processor ...20 1.6 System Memory ...21 1.6.1 Memory Features 21 1.6.2 Memory Configurations 23 1.7 Intel® 875P Chipset ...28 1.7.1 AGP ...29 1.7.2 USB...29 1.7.3 IDE Support 30 1.7.4 Real-Time Clock, CMOS SRAM, and Battery 32 1.7.5 Intel® 82802AC Firmware Hub (FWH 32 1.8 I/O Controller ...32 1.8.1 Serial Port ...33 1.8.2 Parallel Port 33 1.8.3 Diskette Drive Controller 33 1.8.4 Keyboard and Mouse Interface 33 1.9 Audio Subsystem (Optional 34 1.9.1 Audio Subsystem Software 34 1.9.2 Intel® Flex 6 Audio Subsystem 34 1.9.3 Audio Connectors 36 1.10 LAN Subsystem...37 1.10.1 LAN Subsystem Software 37 1.10.2 Intel® 82547EI Platform LAN Connect Device 37 1.10.3 RJ-45 LAN Connector with Integrated LEDs 37 1.11 Hardware Management Subsystem 38 1.11.1 Hardware Monitoring and Fan Control ASIC 38 1.11.2 Thermal Monitoring 39 1.11.3 Fan Monitoring 40 1.11.4 Chassis Intrusion and Detection 40 1.12 Power Management 40 1.12.1 ACPI...41 1.12.2 Hardware Support 43 v

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v
Contents
1
Product Description
1.1
Overview
....................................................................................................................
12
1.1.1
Feature Summary
........................................................................................
12
1.1.2
Manufacturing Options
.................................................................................
13
1.1.3
Board Layout
................................................................................................
14
1.1.4
Block Diagram
..............................................................................................
15
1.2
Online Support
...........................................................................................................
16
1.3
Operating System Support
.........................................................................................
16
1.4
Design Specifications
.................................................................................................
17
1.5
Processor
...................................................................................................................
20
1.6
System Memory
.........................................................................................................
21
1.6.1
Memory Features
.........................................................................................
21
1.6.2
Memory Configurations
................................................................................
23
1.7
Intel
®
875P Chipset
....................................................................................................
28
1.7.1
AGP
.............................................................................................................
29
1.7.2
USB
..............................................................................................................
29
1.7.3
IDE Support
.................................................................................................
30
1.7.4
Real-Time Clock, CMOS SRAM, and Battery
...............................................
32
1.7.5
Intel
®
82802AC Firmware Hub (FWH)
..........................................................
32
1.8
I/O Controller
..............................................................................................................
32
1.8.1
Serial Port
....................................................................................................
33
1.8.2
Parallel Port
..................................................................................................
33
1.8.3
Diskette Drive Controller
..............................................................................
33
1.8.4
Keyboard and Mouse Interface
....................................................................
33
1.9
Audio Subsystem (Optional)
.......................................................................................
34
1.9.1
Audio Subsystem Software
..........................................................................
34
1.9.2
Intel
®
Flex 6 Audio Subsystem
.....................................................................
34
1.9.3
Audio Connectors
.........................................................................................
36
1.10
LAN Subsystem
..........................................................................................................
37
1.10.1
LAN Subsystem Software
............................................................................
37
1.10.2
Intel
®
82547EI Platform LAN Connect Device
..............................................
37
1.10.3
RJ-45 LAN Connector with Integrated LEDs
................................................
37
1.11
Hardware Management Subsystem
............................................................................
38
1.11.1
Hardware Monitoring and Fan Control ASIC
................................................
38
1.11.2
Thermal Monitoring
......................................................................................
39
1.11.3
Fan Monitoring
.............................................................................................
40
1.11.4
Chassis Intrusion and Detection
...................................................................
40
1.12
Power Management
...................................................................................................
40
1.12.1
ACPI
.............................................................................................................
41
1.12.2
Hardware Support
........................................................................................
43