Intel X5472 Data Sheet - Page 3

Contents - processor

Page 3 highlights

Contents 1 Introduction ...9 1.1 Terminology ...10 1.2 State of Data ...13 1.3 References ...13 2 Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications 15 2.1 Front Side Bus and GTLREF 15 2.2 Power and Ground Lands 16 2.3 Decoupling Guidelines 16 2.3.1 VCC Decoupling 16 2.3.2 VTT Decoupling 16 2.3.3 Front Side Bus AGTL+ Decoupling 16 2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking 17 2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0 17 2.4.2 PLL Power Supply 18 2.5 Voltage Identification (VID 18 2.6 Reserved, Unused, and Test Signals 21 2.7 Front Side Bus Signal Groups 22 2.8 CMOS Asynchronous and Open Drain Asynchronous Signals 24 2.9 Test Access Port (TAP) Connection 24 2.10 Platform Environmental Control Interface (PECI) DC Specifications 24 2.10.1 DC Characteristics 24 2.10.2 Input Device Hysteresis 25 2.11 Mixing Processors 26 2.12 Absolute Maximum and Minimum Ratings 26 2.13 Processor DC Specifications 27 2.13.1 Flexible Motherboard Guidelines (FMB 27 2.13.2 VCC Overshoot Specification 38 2.13.3 Die Voltage Validation 39 2.14 AGTL+ FSB Specifications 39 3 Mechanical Specifications 43 3.1 Package Mechanical Drawings 43 3.2 Processor Component Keepout Zones 47 3.3 Package Loading Specifications 47 3.4 Package Handling Guidelines 48 3.5 Package Insertion Specifications 48 3.6 Processor Mass Specifications 48 3.7 Processor Materials 48 3.8 Processor Markings 48 3.9 Processor Land Coordinates 49 4 Land Listing...51 4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments 51 4.1.1 Land Listing by Land Name 51 4.1.2 Land Listing by Land Number 61 5 Signal Definitions ...71 5.1 Signal Definitions 71 6 Thermal Specifications 79 6.1 Package Thermal Specifications 79 6.1.1 Thermal Specifications 79 6.1.2 Thermal Metrology 90 6.2 Processor Thermal Features 90 Quad-Core Intel® Xeon® Processor 5400 Series Datasheet 3

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Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
3
Contents
1
Introduction
..............................................................................................................
9
1.1
Terminology
.....................................................................................................
10
1.2
State of Data
....................................................................................................
13
1.3
References
.......................................................................................................
13
2
Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications
................
15
2.1
Front Side Bus and GTLREF
................................................................................
15
2.2
Power and Ground Lands
....................................................................................
16
2.3
Decoupling Guidelines
........................................................................................
16
2.3.1
VCC
Decoupling
......................................................................................
16
2.3.2
VTT
Decoupling
......................................................................................
16
2.3.3
Front Side Bus AGTL+ Decoupling
............................................................
16
2.4
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
.......................................
17
2.4.1
Front Side Bus Frequency Select Signals (BSEL[2:0])
..................................
17
2.4.2
PLL Power Supply
...................................................................................
18
2.5
Voltage Identification (VID)
................................................................................
18
2.6
Reserved, Unused, and Test Signals
.....................................................................
21
2.7
Front Side Bus Signal Groups
..............................................................................
22
2.8
CMOS Asynchronous and Open Drain Asynchronous Signals
....................................
24
2.9
Test Access Port (TAP) Connection
.......................................................................
24
2.10
Platform Environmental Control Interface (PECI) DC Specifications
...........................
24
2.10.1
DC Characteristics
..................................................................................
24
2.10.2
Input Device Hysteresis
..........................................................................
25
2.11
Mixing Processors
..............................................................................................
26
2.12
Absolute Maximum and Minimum Ratings
.............................................................
26
2.13
Processor DC Specifications
................................................................................
27
2.13.1
Flexible Motherboard Guidelines (FMB)
......................................................
27
2.13.2
VCC Overshoot Specification
....................................................................
38
2.13.3
Die Voltage Validation
.............................................................................
39
2.14
AGTL+ FSB Specifications
...................................................................................
39
3
Mechanical Specifications
........................................................................................
43
3.1
Package Mechanical Drawings
.............................................................................
43
3.2
Processor Component Keepout Zones
...................................................................
47
3.3
Package Loading Specifications
...........................................................................
47
3.4
Package Handling Guidelines
...............................................................................
48
3.5
Package Insertion Specifications
..........................................................................
48
3.6
Processor Mass Specifications
.............................................................................
48
3.7
Processor Materials
............................................................................................
48
3.8
Processor Markings
............................................................................................
48
3.9
Processor Land Coordinates
................................................................................
49
4
Land Listing
.............................................................................................................
51
4.1
Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments
...........................
51
4.1.1
Land Listing by Land Name
......................................................................
51
4.1.2
Land Listing by Land Number
...................................................................
61
5
Signal Definitions
....................................................................................................
71
5.1
Signal Definitions
..............................................................................................
71
6
Thermal Specifications
............................................................................................
79
6.1
Package Thermal Specifications
...........................................................................
79
6.1.1
Thermal Specifications
............................................................................
79
6.1.2
Thermal Metrology
.................................................................................
90
6.2
Processor Thermal Features
................................................................................
90