Intel X5472 Data Sheet - Page 83

83

Thermal Specifications

Notes:

1.

These values are specified at V

CC_MAX

for all processor frequencies. Systems must be designed to ensure

the processor is not to be subjected to any static V

CC

and I

CC

combination wherein V

CC

exceeds V

CC_MAX

at

specified ICC. Please refer to the loadline specifications in

Section 2.13.1

.

2.

Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not

the maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

3.

These specifications are based on silicon characterization.

4.

Power specifications are defined at all VIDs found in

Table 2-3

. The Quad-Core Intel® Xeon® Processor

X5400 Series may be shipped under multiple VIDs for each frequency.

5.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor

frequency requirements.

Notes:

1.

Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to

Table 6-4

for

discrete points that constitute the thermal profile.

2.

Implementation of the Quad-Core Intel® Xeon® Processor X5400 Series

Thermal Profile A should result in

virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet Thermal Profile A

will result in increased probability of TCC activation and may incur measurable performance loss. (See

Section 6.2

for details on TCC activation).

3.

Thermal Profile B is representative of a volumetrically constrained platform. Please refer to

Table 6-5

for

discrete points that constitute the thermal profile.

4.

Implementation of the Quad-Core Intel® Xeon® Processor X5400 Series

Thermal Profile B will result in

increased probability of TCC activation and measurable performance loss. Furthermore, utilization of

thermal solutions that do not meet Thermal Profile B do not meet the processor’s thermal specifications

and may result in permanent damage to the processor.

5.

Refer to the

Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines

(TMDG)

for system and environmental implementation details.

Table 6-3.

Quad-Core Intel® Xeon® Processor X5400 Series Thermal Specifications

Core

Frequency

Thermal

Design Power

(W)

Minimum

T

CASE

(°C)

Maximum

T

CASE

(°C)

Notes

Launch to FMB

120

5

See

Figure 6-2

;

Table 6-4

;

Table 6-5

1, 2, 3, 4, 5

Figure 6-2.

Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profiles A and B

40

45

50

55

60

65

70

75

0

10

20

30

40

50

60

70

80

90

100

110

120

Power [W]

Tcase [C]

TCASE_MAX is a thermal solution design point. In actuality, units

will not significantly exceed TCASE_MAX_A due to TCC activation.

Thermal Profile A

Y = 0.168*x + 42.8

Thermal Profile B

Y = 0.221*x + 43.5

Section	Page
Quad-Core Intel® Xeon® Processor 5400 Series	1
1 Introduction	9
1.1 Terminology	10
1.2 State of Data	13
1.3 References	13
2 Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	16
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	17
2.4.2 PLL Power Supply	18
2.5 Voltage Identification (VID)	18
2.6 Reserved, Unused, and Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	38
2.13.3 Die Voltage Validation	39
2.14 AGTL+ FSB Specifications	39
3 Mechanical Specifications	43
3.1 Package Mechanical Drawings	43
3.2 Processor Component Keepout Zones	47
3.3 Package Loading Specifications	47
3.4 Package Handling Guidelines	48
3.5 Package Insertion Specifications	48
3.6 Processor Mass Specifications	48
3.7 Processor Materials	48
3.8 Processor Markings	48
3.9 Processor Land Coordinates	49
4 Land Listing	51
4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments	51
4.1.1 Land Listing by Land Name	51
4.1.2 Land Listing by Land Number	61
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	90
6.2 Processor Thermal Features	90
6.2.1 Intel® Thermal Monitor Features	90
6.2.2 On-Demand Mode	92
6.2.3 PROCHOT# Signal	93
6.2.4 FORCEPR# Signal	93
6.2.5 THERMTRIP# Signal	94
6.3 Platform Environment Control Interface (PECI)	94
6.3.1 Introduction	94
6.3.2 PECI Specifications	96
7 Features	97
7.1 Power-On Configuration Options	97
7.2 Clock Control and Low Power States	97
7.2.1 Normal State	98
7.2.2 HALT or Extended HALT State	98
7.2.3 Stop-Grant State	100
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	101
7.3 Enhanced Intel SpeedStep® Technology	101
8 Boxed Processor Specifications	103
8.1 Introduction	103
8.2 Mechanical Specifications	105
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	105
8.2.2 Boxed Processor Heat Sink Weight	113
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	113
8.3 Electrical Requirements	113
8.3.1 Fan Power Supply (Active CEK)	113
8.3.2 Boxed Processor Cooling Requirements	114
8.4 Boxed Processor Contents	115
9 Debug Tools Specifications	117
9.1 Debug Port System Requirements	117
9.2 Target System Implementation	117
9.2.1 System Implementation	117
9.3 Logic Analyzer Interface (LAI)	117
9.3.1 Mechanical Considerations	118

Intel X5472 Data Sheet - Page 83

Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profiles A and B

Page 83 highlights