Intel X5472 Data Sheet - Page 81
Quad-Core Intel® Xeon® Processor X5492 and X5482 C-stepThermal Profile
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Thermal Specifications power dissipation is currently planned. Intel® Thermal Monitor 1 and Intel® Thermal Monitor 2 feature must be enabled for the processor to remain within its specifications. Table 6-1. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step) Thermal Specifications Core Frequency Launch to FMB Thermal Design Power (W) 150 (X5492 and X5482 C-step) Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-1; Table 6-2 Notes 1,2,3,4,5,6 Notes: 1. These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the loadline specifications in Section 2.13.1. 2. Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE. 3. These specifications are based on silicon characterization. 4. Power specifications are defined at all VIDs found in Table 2-3. The Quad-Core Intel® Xeon® Processor X5482 may be shipped under multiple VIDs for each frequency. 5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. 6. The Quad-Core Intel® Xeon® Processor X5482 is intended for dual processor workstations only. Figure 6-1. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step)Thermal Profile Thermal Profile (2U) 75 70 65 60 Tcase [C] 55 50 Thermal Profile 45 Y = 0.187*x + 35 40 35 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Pow e r [W] Notes: 1. Please refer to Table 6-2 for discrete points that constitute the thermal profile. 2. Implementation of the Quad-Core Intel® Xeon® Processor X5482 Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss. 3. Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG) for system and environmental implementation details. 81