4
Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
6.2.1
Intel
®
Thermal Monitor Features
...............................................................
90
6.2.2
On-Demand Mode
...................................................................................
92
6.2.3
PROCHOT# Signal
..................................................................................
93
6.2.4
FORCEPR# Signal
...................................................................................
93
6.2.5
THERMTRIP# Signal
................................................................................
94
6.3
Platform Environment Control Interface (PECI)
......................................................
94
6.3.1
Introduction
...........................................................................................
94
6.3.2
PECI Specifications
.................................................................................
96
7
Features
..................................................................................................................
97
7.1
Power-On Configuration Options
..........................................................................
97
7.2
Clock Control and Low Power States
.....................................................................
97
7.2.1
Normal State
.........................................................................................
98
7.2.2
HALT or Extended HALT State
...................................................................
98
7.2.3
Stop-Grant State
..................................................................................
100
7.2.4
Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State
.........................................................................
101
7.3
Enhanced Intel SpeedStep® Technology
.............................................................
101
8
Boxed Processor Specifications
..............................................................................
103
8.1
Introduction
....................................................................................................
103
8.2
Mechanical Specifications
..................................................................................
105
8.2.1
Boxed Processor Heat Sink Dimensions (CEK)
...........................................
105
8.2.2
Boxed Processor Heat Sink Weight
..........................................................
113
8.2.3
Boxed Processor Retention Mechanism and Heat Sink
Support (CEK)
......................................................................................
113
8.3
Electrical Requirements
....................................................................................
113
8.3.1
Fan Power Supply (Active CEK)
...............................................................
113
8.3.2
Boxed Processor Cooling Requirements
....................................................
114
8.4
Boxed Processor Contents
.................................................................................
115
9
Debug Tools Specifications
....................................................................................
117
9.1
Debug Port System Requirements
......................................................................
117
9.2
Target System Implementation
..........................................................................
117
9.2.1
System Implementation
.........................................................................
117
9.3
Logic Analyzer Interface (LAI)
...........................................................................
117
9.3.1
Mechanical Considerations
.....................................................................
118
9.3.2
Electrical Considerations
........................................................................
118