Toshiba MW27F51 Service Manual - Page 34

Removal And Installation Of Flat, Package Ic - vertical ic

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DISASSEMBLY INSTRUCTIONS 5. REMOVAL AND INSTALLATION OF FLAT PACKAGE IC REMOVAL 1. Put Masking Tape (cotton tape) around the Flat Package IC to protect other parts from any damage. (Refer to Fig. 5-1.) NOTE Masking is carried out on all the parts located within 10 mm distance from IC leads. IC Masking Tape (Cotton Tape) 3. When IC starts moving back and forth easily after desoldering completely, pickup the corner of the IC using a tweezers and remove the IC by moving with the IC desoldering machine. (Refer to Fig. 5-3.) NOTE Some ICs on the PCB are affixed with glue, so be careful not to break or damage the foil of each IC leads or solder lands under the IC when removing it. Blower type IC desoldering machine Fig. 5-1 2. Heat the IC leads using a blower type IC desoldering machine. (Refer to Fig. 5-2.) NOTE Do not rotate or move the IC back and forth , until IC can move back and forth easily after desoldering the leads completely. Blower type IC desoldering machine Tweezers IC Fig. 5-3 4. Peel off the Masking Tape. 5. Absorb the solder left on the pattern using the Braided Shield Wire. (Refer to Fig. 5-4.) NOTE Do not move the Braided Shield Wire in the vertical direction towards the IC pattern. Braided Shield Wire Soldering Iron IC Fig. 5-2 IC pattern Fig. 5-4 B5-1

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DISASSEMBLY INSTRUCTIONS
B5-1
5. REMOVAL AND INSTALLATION OF FLAT
PACKAGE IC
REMOVAL
1.
Put Masking Tape (cotton tape) around the Flat Package
IC to protect other parts from any damage.
(Refer to Fig. 5-1.)
NOTE
Masking is carried out on all the parts located within
10 mm distance from IC leads.
Fig. 5-1
Masking Tape
(Cotton Tape)
IC
2.
Heat the IC leads using a blower type IC desoldering
machine.
(Refer to Fig. 5-2.)
NOTE
Do not rotate or move the IC back and forth , until IC
can move back and forth easily after desoldering the
leads completely.
Fig. 5-2
Blower type IC
desoldering machine
IC
3.
When IC starts moving back and forth easily after
desoldering completely, pickup the corner of the IC using
a tweezers and remove the IC by moving with the IC
desoldering machine.
(Refer to Fig. 5-3.)
NOTE
Some ICs on the PCB are affixed with glue, so be
careful not to break or damage the foil of each IC
leads or solder lands under the IC when removing it.
Fig. 5-3
Blower type IC
desoldering machine
Tweezers
IC
4.
5.
Peel off the Masking Tape.
Absorb the solder left on the pattern using the Braided
Shield Wire.
(Refer to Fig. 5-4.)
NOTE
Do not move the Braided Shield Wire in the vertical
direction towards the IC pattern.
Fig. 5-4
Braided Shield Wire
Soldering Iron
IC pattern