Asus TUWE-M TUWE-M User Manual - Page 8

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2. FEATURES Specifications 2. FEATURES 2.1 The ASUS TUWE-M The ASUS TUWE-M motherboard is carefully designed for the demanding PC user who wants advanced features processed by the fastest processors. 2.1.1 Core Specifications • Latest Intel Processor Support P III® Tualatin™ 100/133MHz FSB FC-PGA2 P III® Coppermine™ 100/133MHz FSB FC-PGA Celeron™ 100/66MHz FSB FC-PGA • North Bridge System Chipset: The Intel® 810E2 chipset supports the latest Intel® Tualatin™ processor and offers full backward compatibility to PIII® Coppermine™ and Celeron™ CPUs. The chipset supports industry standard 66/100/133 Front Side Busses (FSBs), and up to 512MB of PC100 SDRAM, and a 3D/2D hardware accelerator. • South Bridge System Chipset: The Intel I/O Controller Hub 2 (ICH2) features support for UltraDMA/100, which allows burst mode data ASUS IrDA-compliant infrared module transfer rates of up to 100MB/sec; two USB controllers for a total of 4 USB ports. • Intel® Accelerated Hub Architecture: Features a dedicated high speed hub link between the ICH2 and GMCH with a bandwidth of 266MB/sec - twice the maximum bandwidth of the PCI bus. • PC100 Memory Support: Equipped with two Dual Inline Memory Mod- ule (DIMM) sockets to support PC100-compliant non-ECC SDRAMs (available in 64, 128, 256 densities) up to 512MB. • High-Speed Data Transfer Interface: UltraDMA/100 increases the data transfer rate to 100MB/s. UltraATA/100 is backward compatible with both DMA/66 and DMA/33 with existing DMA devices and systems. (UltraDMA100/66 requires a 40-pin 80-conductor cable to be enabled.) • Super Multi-I/O: Provides two high-speed UART compatible serial ports and one parallel port with EPP and ECP capabilities. UART2 can also be directed from COM2 to the Infrared Module for wireless connections. • Onboard LAN: Provides Intel's 82562ET chipset, an integrated Platform LAN Connect (PLC) device with 10BASE-T/100BASE-TX capabilities. Network connectivity is integrated through the Intel I/O Controller Hub 2 (ICH2), which offers enhanced bus mastering for high-speed data transfers. The bus mastering facility permits high-level command processing. • Smart BIOS: 2Mb firmware provides Vcore and CPU/SDRAM frequency adjustments, boot block write protection, and HD/SCSI/MO/ ZIP/CD/Floppy boot. 8 ASUS TUWE-M User's Manual

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8
ASUS TUWE-M User’s Manual
2.1
The ASUS TUWE-M
The ASUS TUWE-M motherboard is carefully designed for the demanding PC user
who wants advanced features processed by the fastest processors.
2.1.1
Core Specifications
•
Latest Intel Processor Support
P III
®
Tualatin™
100/133MHz FSB FC-PGA2
P
III
®
Coppermine™
100/133MHz FSB FC-PGA
Celeron™
100/66MHz FSB FC-PGA
•
North Bridge System Chipset:
The Intel
®
810E2 chipset supports the
latest Intel
®
Tualatin™ processor and offers full backward compatibility
to PIII
®
Coppermine™ and Celeron™ CPUs.
The chipset supports
industry standard 66/100/133 Front Side Busses (FSBs), and up to 512MB
of PC100 SDRAM, and a 3D/2D hardware accelerator.
•
South Bridge System Chipset:
The Intel I/O Controller Hub 2 (ICH2)
features support for UltraDMA/100, which allows burst mode data
ASUS
IrDA-compliant infrared module transfer rates of up to 100MB/sec; two
USB controllers for a total of 4 USB ports.
•
Intel
®
Accelerated Hub Architecture:
Features a dedicated high speed
hub link between the ICH2 and GMCH with a bandwidth of 266MB/sec
– twice the maximum bandwidth of the PCI bus.
•
PC100 Memory Support:
Equipped with two Dual Inline Memory Mod-
ule (DIMM) sockets to support PC100-compliant non-ECC SDRAMs
(available in 64, 128, 256 densities) up to 512MB.
•
High-Speed Data Transfer Interface:
UltraDMA/100 increases the data
transfer rate to 100MB/s. UltraATA/100 is backward compatible with
both DMA/66 and DMA/33 with existing DMA devices and systems.
(UltraDMA100/66 requires a 40-pin 80-conductor cable to be enabled.)
•
Super Multi-I/O:
Provides two high-speed UART compatible serial ports
and one parallel port with EPP and ECP capabilities. UART2 can
also be directed from COM2 to the Infrared Module for wireless
connections.
•
Onboard LAN:
Provides Intel’s 82562ET chipset, an integrated
Platform LAN Connect (PLC) device with 10BASE-T/100BASE-TX
capabilities. Network connectivity is integrated through the Intel I/O
Controller Hub 2 (ICH2), which offers enhanced bus mastering for
high-speed data transfers. The bus mastering facility permits high-level
command processing.
•
Smart BIOS:
2Mb firmware provides Vcore and CPU/SDRAM
frequency adjustments, boot block write protection, and HD/SCSI/MO/
ZIP/CD/Floppy boot.
2.
FEATURES
Specifications
2.
FEATURES