Brother International 8250P Service Manual - Page 22
Iii. Theory Of Operation, Overview, Mechanisms, Control Electronics
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CONTENTS 1. OVERVIEW...III-1 2. MECHANISMS...III-2 2.1 Scanner Mechanism III-3 2.1.1 Document feeding and ejecting mechanism III-3 2.1.2 Scanner III-3 2.2 Laser Printing Mechanism III-4 2.2.1 Paper pulling-in, registration, feeding, and ejecting mechanism III-4 2.2.2 Print process mechanism III-6 (1) Charging process III-7 (2) Exposing process III-7 (3) Developing process III-8 (4) Transferring process III-8 (5) Erasing process III-8 2.2.3 Heat-fixing mechanism III-9 2.3 Sensors and Actuators III-10 3. CONTROL ELECTRONICS III-12 3.1 Configuration III-12 3.2 Main PCB ...III-13 3.3 NCU PCB ...III-15 3.4 Control Panel PCB III-17 3.5 Power Supply PCB III-18 [ 1 ] Low-voltage power supply PCB III-18 [ 2 ] High-voltage power supply PCB III-19
CONTENTS
1.
OVERVIEW
...........................................................................................................
III
-1
2.
MECHANISMS
......................................................................................................
III
-2
2.1
Scanner Mechanism
.....................................................................................
III
-3
2.1.1
Document feeding and ejecting mechanism
..........................................
III
-3
2.1.2
Scanner
................................................................................................
III
-3
2.2
Laser Printing Mechanism
.............................................................................
III
-4
2.2.1
Paper pulling-in, registration, feeding, and ejecting mechanism
.............
III
-4
2.2.2
Print process mechanism
......................................................................
III
-6
(1)
Charging process
..........................................................................
III
-7
(2)
Exposing process
.........................................................................
III
-7
(3)
Developing process
......................................................................
III
-8
(4)
Transferring process
.....................................................................
III
-8
(5)
Erasing process
............................................................................
III
-8
2.2.3
Heat-fixing mechanism
...........................................................................
III
-9
2.3
Sensors and Actuators
..................................................................................
III
-10
3.
CONTROL ELECTRONICS
..................................................................................
III
-12
3.1
Configuration
................................................................................................
III
-12
3.2
Main PCB
.....................................................................................................
III
-13
3.3
NCU PCB
.....................................................................................................
III
-15
3.4
Control Panel PCB
........................................................................................
III
-17
3.5
Power Supply PCB
.......................................................................................
III
-18
[ 1 ]
Low-voltage power supply PCB
....................................................
III
-18
[ 2 ]
High-voltage power supply PCB
...................................................
III
-19