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HP 2000-150CA Service Guide - Page 91

included with the base enclosure, fan/heat sink assembly, processor, and system board spare part kits.

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NOTE: The following illustration shows the fan/heat sink assembly removal process on a computer model equipped with an Intel processor, the Intel HM45 chipset, and a graphics subsystem with UMA memory. The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, fan/heat sink assembly, processor, and system board spare part kits. NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor. Component replacement procedures 83

Section	Page
Product description	9
External component identification	17
Display	17
Button	18
Keys	19
Lights	20
TouchPad	21
Left side	22
Right side	23
Bottom	24
Illustrated parts catalog	25
Service tag	25
Computer major components	27
Cable Kit	33
Display assembly subcomponents	34
Mass storage devices	35
Plastics Kit	36
Miscellaneous parts	37
Sequential part number listing	38
Removal and replacement procedures	45
Preliminary replacement requirements	45
Tools required	45
Service considerations	45
Plastic parts	45
Cables and connectors	45
Drive handling	46
Grounding guidelines	46
Electrostatic discharge damage	46
Packaging and transporting guidelines	48
Workstation guidelines	48
Equipment guidelines	49
Component replacement procedures	50
Service tag	50
Computer feet	51
Battery	51
Optical drive (select models only)	52
WLAN module	55
Memory module	57
Hard drive	58
Keyboard	61
Top cover	64
Power button board	67
TouchPad button board	68
USB board	70
Power connector cable	71
Speakers	73
Optical drive connector cable	75
Display assembly	76
System board	82
RTC battery	86
Fan/heat sink assembly	87
Processor	94
Setup Utility (BIOS) and System Diagnostics	97
Using Setup Utility	97
Starting Setup Utility	97
Changing the language of Setup Utility	97
Navigating and selecting in Setup Utility	98
Displaying system information	98
Restoring factory settings in Setup Utility	99
Exiting Setup Utility	99
Updating the BIOS	99
Determining the BIOS version	100
Downloading a BIOS update	100
Using System Diagnostics	101
Specifications	102
Computer specifications	102
15.6-inch display specifications	103
Hard drive specifications	104
Backup and recovery	105
Restore	105
Creating restore media	106
Performing a system restore	107
Restoring using the dedicated recovery partition (select models only)	107
Restoring using the restore media	108
Changing the computer boot order	108
Backing up and recovering your information	109
Using Windows Backup and Restore	110
Using Windows system restore points	110
When to create restore points	110
Create a system restore point	111
Restore to a previous date and time	111
Power cord set requirements	112
Requirements for all countries	112
Requirements for specific countries and regions	113
Recycling	114
Battery	114
Display	114

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NOTE:

The following illustration shows the fan/heat sink assembly removal process on a computer

model equipped with an Intel processor, the Intel HM45 chipset, and a graphics subsystem with

UMA memory.

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and

the system board components each time the heat sink is removed. Replacement thermal material is

included with the base enclosure, fan/heat sink assembly, processor, and system board spare part kits.

NOTE:

The following illustration shows the replacement thermal material locations on a computer

model equipped with an AMD processor.

Component replacement procedures