HP ENVY 14-3010nr HP ENVY14 SPECTRE Maintenance and Service Guide IMPORTANT! T - Page 69

The thermal material must be thoroughly cleaned from the surfaces of the processor heat sink

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e. Wireless audio module (see Wireless audio module on page 50) f. System board (see System board on page 56) NOTE: When replacing the heat sink, be sure to remove the fans from the defective heat sink and replace them on the replacement heat sink. See Fan on page 54 for fan removal and replacement instructions. Remove the processor heat sink: 1. Following the 1, 2, 3, 4 sequence stamped into the processor heat sink, loosen the four captive Philllips screws (1) that secure the processor heat sink to the system board. 2. Remove the processor heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the processor heat sink and processor, it may be necessary to move the processor heat sink from side to side to detach it. The thermal material must be thoroughly cleaned from the surfaces of the processor heat sink and the processor each time the processor heat sink is removed. Replacement thermal material is included with the processor heat sink and system board spare part kits. NOTE: The following illustration shows the replacement thermal material locations. Thermal paste is used on the processor (1) and the processor heat sink section (2) that services it. Component replacement procedures 61

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e.
Wireless audio module (see
Wireless audio module
on page
50
)
f.
System board (see
System board
on page
56
)
NOTE:
When replacing the heat sink, be sure to remove the fans from the defective heat sink and
replace them on the replacement heat sink. See
Fan
on page
54
for fan removal and replacement
instructions.
Remove the processor heat sink:
1.
Following the 1, 2, 3, 4 sequence stamped into the processor heat sink, loosen the four captive
Philllips screws
(1)
that secure the processor heat sink to the system board.
2.
Remove the processor heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the processor heat
sink and processor, it may be necessary to move the processor heat sink from side to side to
detach it.
The thermal material must be thoroughly cleaned from the surfaces of the processor heat sink and
the processor each time the processor heat sink is removed. Replacement thermal material is included
with the processor heat sink and system board spare part kits.
NOTE:
The following illustration shows the replacement thermal material locations. Thermal paste is
used on the processor
(1)
and the processor heat sink section
(2)
that services it.
Component replacement procedures
61