HP OMEN 17-an000 Maintenance and Service Guide - Page 67

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a. Base enclosure (see Base enclosure on page 45) b. Battery (see Battery on page 38) c. Speakers (see Speakers on page 47). d. Optical drive (see Optical drive on page 48) e. Remove the fans (see Fans on page 53) Remove the heat sink: Following the sequence stamped into the heat sink, loosen the eight Phillips screws (1) and then carefully lift the heat sink (2) to remove it from the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Thermal paste is used on the processor (1), the graphics processor (3), and the heat sink sections (2 and 4) that service the processors. Component replacement procedures 55

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a.
Base enclosure (see
Base enclosure
on page
45
)
b.
Battery (see
Battery
on page
38
)
c.
Speakers (see
Speakers
on page
47
).
d.
Optical drive (see
Optical drive
on page
48
)
e.
Remove the fans (see
Fans
on page
53
)
Remove the heat sink:
Following the sequence stamped into the heat sink, loosen the eight Phillips screws
(1)
and then carefully lift
the heat sink
(2)
to remove it from the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and the system
board components, it may be necessary to move the heat sink from side to side to detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Thermal paste is used on the processor
(1)
, the
graphics processor
(3)
, and the heat sink sections
(2 and 4)
that service the processors.
Component replacement procedures
55