HP Pavilion 11-s000 Maintenance and Service Guide - Page 47

Heat sink, The thermal material must be thoroughly cleaned from the surfaces of the heat sink

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Heat sink Description Heat sink (includes replacement thermal material) Spare part number 830781-001 Before removing the heat sink, follow these steps: 1. Turn off the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system. 2. Disconnect the power from the computer by unplugging the power cord from the computer. 3. Disconnect all external devices from the computer. 4. Remove the keyboard/top cover (see Keyboard/top cover on page 24). 5. Remove the battery (see Battery on page 32). Remove the heat sink: 1. Remove the two Phillips PM2.0×2.2 broadhead screws (1) that secure the heat sink to the system board. 2. Remove the heat sink (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Component replacement procedures 39

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Heat sink
Description
Spare part number
Heat sink (includes replacement thermal material)
830781-001
Before removing the heat sink, follow these steps:
1.
Turn
off
the computer. If you are unsure whether the computer is
off
or in Hibernation, turn
the computer on, and then shut it down through the operating system.
2.
Disconnect the power from the computer by unplugging the power cord from the computer.
3.
Disconnect all external devices from the computer.
4.
Remove the keyboard/top cover (see
Keyboard/top cover
on page
24
).
5.
Remove the battery (see
Battery
on page
32
).
Remove the heat sink:
1.
Remove the two Phillips PM2.0×2.2 broadhead screws
(1)
that secure the heat sink to the system board.
2.
Remove the heat sink
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the heat sink is removed. Thermal paste is used on
the processor
(1)
and the heat sink section
(2)
that services it.
Component replacement procedures
39