HP Pavilion dv6-2100 HP Pavilion dv6 Entertainment PC - Maintenance and Servic - Page 82
and the graphics subsystem chip and contact, Replacement thermal material is included with all
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Removal and replacement procedures 8. Remove the fan/heat sink assembly 6. ✎ Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly. ✎ The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is applied to the fan/heat sink assembly to correspond with components on the system board as follows: capacitors and their contacts 1, the processor and contact 2, and the graphics subsystem chip and contact 3. Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. Reverse this procedure to install the fan/heat sink assembly. Maintenance and Service Guide 4-43