HP ProBook 6440b HP ProBook 6545b, 6540b, 6445b and 6440b Notebook PC - Mainte - Page 108

Thermal pads are used on the Northbridge chip

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Removal and replacement procedures ✎ The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed: ❏ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ❏ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it. ❏ Thermal pads are used on the Southbridge chip 5 and the heat sink section 6 that services it. Replacement thermal material is included with all system board and heat sink spare part kits. Reverse this procedure to install the heat sink. Maintenance and Service Guide 4-39

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Removal and replacement procedures
Maintenance and Service Guide
4–39
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
each time the heat sink is removed:
❏
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
❏
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
❏
Thermal pads are used on the Southbridge chip
5
and the heat sink section
6
that services it.
Replacement thermal material is included with all system board and heat sink spare part kits.
Reverse this procedure to install the heat sink.