ASRock Z77 OC Formula Quick Installation Guide - Page 6
ASRock, Z77 OC Formula, Motherboard - water cooling
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1.2 Specifications Platform OC Formula Kit CPU Chipset Memory Expansion Slot 6 - CEB Form Factor: 12.0-in x 10.5-in, 30.5 cm x 26.7 cm - Premium Gold Capacitor design (100% Japan-made high-quality Conductive Polymer Capacitors) OC Formula Power Kit - Digi Power - Dual-Stack MOSFET (DSM) (see CAUTION 1) - Multiple Filter Cap (MFC) (Filter different noise by 3 different capacitors: DIP solid cap, POSCAP and MLCC) - Premium Alloy Choke (Reduce 70% core loss compare to iron powder choke) OC Formula Connector Kit - Hi-Density Power Connector - 15μGold Finger (CPU and memory sockets) OC Formula Cooling Kit - Twin-Power Cooling (Combine active air cooling and water cooling) - 8 Layer PCB - 4 x 2oz copper - GELID GC-Extreme Thermal Compound - Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in LGA1155 Package - 12 + 4 Power Phase Design - Supports Intel® Turbo Boost 2.0 Technology - Supports Intel® K-Series unlocked CPU - Supports Hyper-Threading Technology (see CAUTION 2) - Intel® Z77 - Supports Intel® Rapid Start Technology and Smart Connect Technology - Dual Channel DDR3 Memory Technology (see CAUTION 3) - 4 x DDR3 DIMM slots - Supports DDR3 3000+(OC)/2800(OC)/2666(OC)/2400(OC)/ 2133(OC)/1866(OC)/1600/1333/1066 non-ECC, un-buffered memory - Max. capacity of system memory: 32GB (see CAUTION 4) - Supports Intel® Extreme Memory Profile (XMP)1.3/1.2 - 2 x PCI Express 3.0 x16 slots (PCIE2/PCIE4: single at x16 (PCIE2) / x8 (PCIE4) or dual at x8/x8 mode) (see CAUTION 5) * PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With ASRock Z77 OC Formula Motherboard English