HP Pro Tower 400 G9 PCI Desktop PC Maintenance and Service Guide - Page 47

material locations.

Page 47 highlights

2. Remove the access panel (see Access panel on page 19). Remove the heat sink: 1. Disconnect the fan cable from the system board (1). 2. In the order indicated on the heat sink, loosen the four captive Torx screws (2). IMPORTANT: Remove heat sink retaining screws in diagonally opposite pairs (as in an X) to evenly seat the downward forces on the processor. The pins on the socket are fragile, and any damage to them could require replacing the system board. 3. Remove the heat sink from the computer (3). 4. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink and system board spare part kits. The following illustration shows the replacement thermal material locations. Thermal paste is used on the heat sink (1) and on the processor (2). IMPORTANT: Tighten heat sink retaining screws in diagonally opposite pairs (as in an X) to evenly seat the heat sink on the processor to avoid damage that could require replacing the system board. 40 Chapter 4 Removal and replacement procedures

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2.
Remove the access panel (see
Access panel
on page
19
).
Remove the heat sink:
1.
Disconnect the fan cable from the system board
(1)
.
2.
In the order indicated on the heat sink, loosen the four captive Torx screws
(2)
.
IMPORTANT:
Remove heat sink retaining screws in diagonally opposite pairs (as in an X) to evenly seat
the downward forces on the processor. The pins on the socket are fragile, and any damage to them could
require replacing the system board.
3.
Remove the heat sink from the computer
(3)
.
4.
Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the
heat sink and system board spare part kits. The following illustration shows the replacement thermal
material locations.
Thermal paste is used on the heat sink
(1)
and on the processor
(2)
.
IMPORTANT:
Tighten heat sink retaining screws in diagonally opposite pairs (as in an X) to evenly seat the
heat sink on the processor to avoid damage that could require replacing the system board.
40
Chapter 4
Removal and replacement procedures