Intel DH61AG Technical Product Specification - Page 13

Product Description - thin chassis

Page 13 highlights

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 2 summarizes the major features of the board. Table 2. Feature Summary Form Factor Processor Memory Chipset Graphics Audio Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]) • Intel® Core i7, Intel® Core™ i5, Intel® Core™ i3, Intel® Pentium®, Intel® Celeron®, and Intel® Xeon® processors in an LGA1155 socket with up to 65 W TDP: ― Integrated graphics processing (processors with Intel® Graphics Technology) ― Integrated PCI Express* v2.0 interface controller ― Integrated memory controller • Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM) sockets • Support for DDR3 1333 MHz and DDR3 1066 MHz SO-DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory Intel® H61 Express Chipset consisting of the Intel® H61 Express Platform Controller Hub (PCH) • Integrated graphics support for processors with Intel Graphics Technology: ― High Definition Multimedia Interface* (HDMI*) ― DVI-I ― Internal flat panel displays: LVDS eDP (Embedded DisplayPort*) • 10-channel (8+2) Intel® High Definition (Intel® HD) audio via the Realtek* ALC892 audio codec ― Digital/analog stereo line-out (2-in-1 digital/analog back panel jack) ― In-chassis stereo speakers support (3 W/4 Ω via internal header) ― AV-compliant 7.1 (see note on page 32) surround support (analog line-level via internal header) ― Secondary S/PDIF digital audio output (internal header) ― DMIC digital microphone input (internal header) ― Analog line-in (back panel jack) ― Front panel HD Audio/AC'97 headphones/mic support (internal header) • 8-channel (7.1) Intel High Definition Audio via the HDMI interface continued 13

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13
1
Product Description
1.1
Overview
1.1.1
Feature Summary
Table 2 summarizes the major features of the board.
Table 2.
Feature Summary
Form Factor
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor
Intel
®
Core i7, Intel
®
Core™ i5, Intel
®
Core™ i3, Intel
®
Pentium
®
, Intel
®
Celeron
®
, and Intel
®
Xeon
®
processors in an LGA1155 socket with up to 65 W
TDP:
Integrated graphics processing (processors with Intel
®
Graphics
Technology)
Integrated PCI Express* v2.0 interface controller
Integrated memory controller
Memory
Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module
(SO-DIMM) sockets
Support for DDR3 1333 MHz and DDR3 1066 MHz SO-DIMMs
Support for 1 Gb, 2 Gb, and 4 Gb memory technology
Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
Support for non-ECC memory
Support for 1.35 V low voltage JEDEC memory
Chipset
Intel
®
H61 Express Chipset consisting of the Intel
®
H61 Express Platform
Controller Hub (PCH)
Graphics
Integrated graphics support for processors with Intel Graphics Technology:
High Definition Multimedia Interface* (HDMI*)
DVI-I
Internal flat panel displays:
±
LVDS
±
eDP (Embedded DisplayPort*)
Audio
10-channel (8+2) Intel
®
High Definition (Intel
®
HD) audio via the Realtek*
ALC892 audio codec
Digital/analog stereo line-out (2-in-1 digital/analog back panel jack)
In-chassis stereo speakers support (3 W/4
Ω
via internal header)
AV-compliant 7.1 (see note on page 32) surround support (analog line-level
via internal header)
Secondary S/PDIF digital audio output (internal header)
DMIC digital microphone input (internal header)
Analog line-in (back panel jack)
Front panel HD Audio/AC’97 headphones/mic support (internal header)
8-channel (7.1) Intel High Definition Audio via the HDMI interface
continued