Intel DH61AG Technical Product Specification - Page 75

Table 42., Thermal Considerations for Components, Table 43., Tcontrol Values for Components

Get Intel DH61AG PDF manuals and user guides View all Intel DH61AG manuals
Add to My Manuals
Save this manual to your list of manuals

Page 75 highlights

Technical Reference Table 42 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 42. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel H61 Express Chipset 104 oC To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 43. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature. It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol. Table 43. Tcontrol Values for Components Component Tcontrol Processor For processor case temperature, see processor datasheets and processor specification updates Intel H61 Express Chipset 104 oC For information about Processor datasheets and specification updates Intel® 6 Series Chipset Thermal Mechanical Specifications and Design Guidelines Refer to Section 1.2, page 19 http://www.intel.com/Products/Desktop/ Chipsets/ec-h61/h61technicaldocuments.htm 75

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
Technical Reference
75
Table 42 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 42.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H61 Express Chipset
104
o
C
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 43. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol.
Table 43.
Tcontrol Values for Components
Component
Tcontrol
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H61 Express Chipset
104
o
C
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 19
Intel
®
6 Series Chipset Thermal Mechanical Specifications and
Design Guidelines
Chipsets/ec-h61/h61-
technicaldocuments.htm