Home » Intel Manuals » Motherboards » Intel DH61AG » Manual Viewer

Intel DH61AG Technical Product Specification - Page 76

Reliability, Environmental

Get Intel DH61AG PDF manuals and user guides

Add to My Manuals
Save this manual to your list of manuals

Page 76 highlights

Intel Desktop Board DH61AG Technical Product Specification 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board is 298,107 hours. 2.9 Environmental Table 44 lists the environmental specifications for the board. Table 44. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DH61AG Technical Product Specification	1
Revision History	2
Disclaimer	2
Board Identification Information	3
Specification Changes or Clarifications	3
Errata	4
Preface	5
Intended Audience	5
What This Document Contains	5
Typographical Conventions	5
Contents	7
1 Product Description	13
1.1 Overview	13
1.1.1 Feature Summary	13
1.1.2 Board Layout (Top)	15
1.1.3 Board Layout (Bottom)	17
1.1.4 Block Diagram	18
1.2 Online Support	19
1.3 Processor	19
1.4 System Memory	20
1.4.1 Memory Configurations	21
1.5 Intel® H61 Express Chipset	23
1.6 Graphics Subsystem	23
1.6.1 Integrated Graphics	23
1.6.2 Flat Panel Display Interfaces	26
1.6.3 USB	29
1.7 SATA Interfaces	30
1.7.1 AHCI Mode	30
1.8 Real-Time Clock Subsystem	31
1.9 Legacy I/O Controller	31
1.9.1 Consumer Infrared (CIR)	31
1.10 Audio Subsystem	32
1.10.1 Audio Subsystem Software	33
1.10.2 Audio Subsystem Components	33
1.11 LAN Subsystem	35
1.11.1 Intel® 82579V Gigabit Ethernet Controller	35
1.11.2 LAN Subsystem Software	36
1.11.3 RJ-45 LAN Connector with Integrated LEDs	36
1.12 Hardware Management Subsystem	37
1.12.1 Hardware Monitoring	37
1.12.2 Fan Monitoring	37
1.12.3 Thermal Monitoring	38
1.13 Power Management	39
1.13.1 ACPI	39
1.13.2 Hardware Support	41
2 Technical Reference	45
2.1 Memory Resources	45
2.1.1 Addressable Memory	45
2.1.2 Memory Map	47
2.2 Connectors and Headers	47
2.2.1 Back Panel Connectors	48
2.2.2 Connectors and Headers (Top)	49
2.2.3 Connectors and Headers (Bottom)	51
2.3 I/O Shields	64
2.4 Jumper Block	67
2.5 Mechanical Considerations	68
2.5.1 Form Factor	68
2.5.2 Board 3D View	70
2.6 Electrical Considerations	71
2.6.1 Power Supply Considerations	71
2.6.2 Fan Header Current Capability	73
2.6.3 PCI Express* Add-in Card Considerations	73
2.7 Thermal Considerations	73
2.8 Reliability	76
2.9 Environmental	76
3 Overview of BIOS Features	77
3.1 Introduction	77
3.2 BIOS Flash Memory Organization	78
3.3 System Management BIOS (SMBIOS)	79
3.4 Legacy USB Support	79
3.5 BIOS Updates	80
3.5.1 Language Support	80
3.5.2 Custom Splash Screen	81
3.6 BIOS Recovery	81
3.7 Boot Options	82
3.7.1 Optical Drive Boot	82
3.7.2 Network Boot	82
3.7.3 Booting Without Attached Devices	82
3.7.4 Changing the Default Boot Device During POST	82
3.8 Hard Disk Drive Password Security Feature	83
3.9 Adjusting Boot Speed	84
3.9.1 Peripheral Selection and Configuration	84
3.9.2 BIOS Boot Optimizations	84
3.10 BIOS Security Features	85
4 Error Messages and Beep Codes	87
4.1 Speaker	87
4.2 BIOS Beep Codes	87
4.3 Front-panel Power LED Blink Codes	88
4.4 BIOS Error Messages	88
4.5 Port 80h POST Codes	89
5 Regulatory Compliance and Battery Disposal Information	95
5.1 Regulatory Compliance	95
5.1.1 Safety Standards	95
5.1.2 European Union Declaration of Conformity Statement	96
5.1.3 Product Ecology Statements	97
5.1.4 EMC Regulations	99
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	102
5.1.6 Regulatory Compliance Marks (Board Level)	103