Intel E5345 Data Sheet - Page 109

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

109

Boxed Processor Specifications

8.3.2.1

1U Passive/3U+ Active Combination Heat Sink Solution (1U Rack

Passive)

In the 1U configuration it is assumed that a chassis duct will be implemented to provide

a minimum airflow of 15 cfm at 0.38 in. H

2

O (25.5 m

3

/hr at 94.6 Pa) of flow

impedance. The duct should be carefully designed to minimize the airflow bypass

around the heatsink. It is assumed that a 40°C TLA is met. This requires a superior

chassis design to limit the T

RISE

at or below 5°C with an external ambient temperature

of 35

°

C. Following these guidelines will allow the designer to meet Quad-Core Intel®

Xeon® Processor X5300 Series Thermal Profile and conform to the thermal

requirements of the processor.

8.3.2.2

1U Passive/3U+ Active Combination Heat Sink Solution (Pedestal

Active)

The active configuration of the combination solution is designed to help pedestal

chassis users to meet the thermal processor requirements without the use of chassis

ducting. It may be still be necessary to implement some form of chassis air guide or air

duct to meet the T

LA

temperature of 40

°

C depending on the pedestal chassis layout.

Also, while the active thermal solution design will mechanically fit into a 2U volumetric,

it may not provide adequate airflow. This is due to the requirement of additional space

at the top of the thermal solution to allow sufficient airflow into the heat sink fan. Use

of the active configuration in a 2U rackmount chassis is not recommended.

It is recommended that the ambient air temperature outside of the chassis be kept at

or below 35°C. The air passing directly over the processor thermal solution should not

be preheated by other system components. Meeting the processor’s temperature

specification is the responsibility of the system integrator.

8.3.2.3

2U Passive Heat Sink Solution (2U+ Rack or Pedestal)

In the 2U+ passive configuration it is assumed that a chassis duct will be implemented

to provide a minimum airflow of 27 cfm at 0.182 in. H

2

O (45.9 m

3

/hr at 45.3 Pa) of

flow impedance. The duct should be carefully designed to minimize the airflow bypass

around the heatsink. The T

LA

temperature of 40

°

C should be met. This may require the

use of superior design techniques to keep T

RISE

at or below 5°C based on an ambient

external temperature of 35°C.

8.4

Boxed Processor Contents

A direct chassis attach method must be used to avoid problems related to shock and

vibration, due to the weight of the thermal solution required to cool the processor. The

board must not bend beyond specification in order to avoid damage. The boxed

processor contains the components necessary to solve both issues. The boxed

processor will include the following items:

•

Quad-Core Intel® Xeon® Processor 5300 Series

•

Unattached heat sink solution

•

Four screws, four springs, and four heat sink standoffs (all captive to the heat sink)

•

Foam air bypass pad and skirt (included with 1U passive/3U+ active solution)

•

Thermal interface material (pre-applied on heat sink)

•

Installation and warranty manual

•

Intel Inside Logo

Section	Page
1 Introduction	9
1.1 Terminology	11
1.2 State of Data	13
1.3 References	13
2 Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	17
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	18
2.4.2 PLL Power Supply	19
2.5 Voltage Identification (VID)	19
2.6 Reserved, Unused, or Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	33
2.13.3 Die Voltage Validation	34
2.14 AGTL+ FSB Specifications	34
3 Mechanical Specifications	39
3.1 Package Mechanical Drawings	39
3.2 Processor Component Keepout Zones	43
3.3 Package Loading Specifications	43
3.4 Package Handling Guidelines	44
3.5 Package Insertion Specifications	44
3.6 Processor Mass Specifications	44
3.7 Processor Materials	44
3.8 Processor Markings	45
3.9 Processor Land Coordinates	45
4 Land Listing	49
4.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments	49
4.1.1 Land Listing by Land Name	49
4.1.2 Land Listing by Land Number	60
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	83
6.2 Processor Thermal Features	84
6.2.1 Thermal Monitor Features	84
6.2.2 Thermal Monitor (TM1)	84
6.2.3 Thermal Monitor 2	85
6.2.4 On-Demand Mode	86
6.2.5 PROCHOT# Signal	87
6.2.6 FORCEPR# Signal	87
6.2.7 THERMTRIP# Signal	88
6.3 Platform Environment Control Interface (PECI)	88
6.3.1 Introduction	88
6.3.2 PECI Specifications	89
7 Features	91
7.1 Power-On Configuration Options	91
7.2 Clock Control and Low Power States	91
7.2.1 Normal State	92
7.2.2 HALT or Extended HALT State	92
7.2.3 Stop-Grant State	94
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	94
7.3 Enhanced Intel SpeedStep® Technology	95
8 Boxed Processor Specifications	97
8.1 Introduction	97
8.2 Mechanical Specifications	99
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	99
8.2.2 Boxed Processor Heat Sink Weight	107
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	107
8.3 Electrical Requirements	107
8.3.1 Fan Power Supply (Active CEK)	107
8.3.2 Boxed Processor Cooling Requirements	108
8.4 Boxed Processor Contents	109
9 Debug Tools Specifications	111
9.1 Debug Port System Requirements	111
9.2 Target System Implementation	111
9.2.1 System Implementation	111
9.3 Logic Analyzer Interface (LAI)	111
9.3.1 Mechanical Considerations	112

Intel E5345 Data Sheet - Page 109

Boxed Processor Contents, 1U Passive/3U+ Active Combination Heat Sink Solution 1U Rack

Page 109 highlights