Intel E5345 Data Sheet - Page 80

Thermal Specifications

80

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

running the most power-intensive applications. Refer to the

Quad-Core Intel® Xeon®

Processor 5300 Series Thermal/Mechanical Design Guidelines

for details on system

thermal solution design, thermal profiles and environmental considerations.

For the Quad-Core Intel® Xeon® Processor X5300 Series, Intel has developed two

thermal profiles, either of which can be implemented. Both ensure adherence to Intel

reliability requirements. Thermal Profile A (see

Figure 6-2

;

Table 6-4

) is representative

of a volumetrically unconstrained thermal solution (that is, industry enabled 2U

heatsink). In this scenario, it is expected that the Thermal Control Circuit (TCC) would

only be activated for very brief periods of time when running the most power intensive

applications. Thermal Profile B (see

Figure 6-2

;

Table 6-5

) is indicative of a constrained

thermal environment (that is, 1U form factor). Because of the reduced cooling

capability represented by this thermal solution, the probability of TCC activation and

performance loss is increased. Additionally, utilization of a thermal solution that does

not meet Thermal Profile B will violate the thermal specifications and may result in

permanent damage to the processor. Refer to the

Quad-Core Intel® Xeon® Processor

5300 Series Thermal/Mechanical Design Guidelines

for details on system thermal

solution design, thermal profiles and environmental considerations.

The upper point of the thermal profile consists of the Thermal Design Power (TDP) and

the associated T

CASE

value. It should be noted that the upper point associated with the

Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B (x = TDP and y =

T

CASE_MAX_B

@ TDP) represents a thermal solution design point. In actuality the

processor case temperature will not reach this value due to TCC activation (see

Figure 6-2

for Quad-Core Intel® Xeon® Processor X5300 Series). The lower point of

the thermal profile consists of x = P

_PROFILE_MIN

and y = T

CASE_MAX

@ P

_PROFILE_MIN

.

P

_PROFILE_MIN

is defined as the processor power at which T

CASE

, calculated from the

thermal profile, is equal to 50°C.

Analysis indicates that real applications are unlikely to cause the processor to consume

maximum power dissipation for sustained time periods. Intel recommends that

complete thermal solution designs target the Thermal Design Power (TDP), instead of

the maximum processor power consumption. The Thermal Monitor feature is intended

to help protect the processor in the event that an application exceeds the TDP

recommendation for a sustained time period. For more details on this feature, refer to

Section 6.2

. To ensure maximum flexibility for future requirements, systems should be

designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower

power dissipation is currently planned.

Thermal Monitor 1 and Thermal Monitor 2

feature must be enabled for the processor to remain within its specifications.

Notes:

1.

These values are specified at V

CC_MAX

for all processor frequencies. Systems must be designed to ensure

the processor is not to be subjected to any static V

CC

and I

CC

combination wherein V

CC

exceeds V

CC_MAX

at

specified I

CC

. Please refer to the loadline specifications in

Section 2

.

2.

Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is

measured at maximum T

CASE

.

3.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the

maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

4.

These specifications are based on initial silicon characterization. These specifications may be further

updated as more characterization data becomes available.

5.

Power specifications are defined at all VIDs found in

Table 2-3

. The Quad-Core Intel® Xeon® Processor

E5300 Series may be shipped under multiple VIDs for each frequency.

Table 6-1.

Quad-Core Intel® Xeon® Processor E5300 Series Thermal Specifications

Core

Frequency

Thermal Design

Power

(W)

Minimum

T

CASE

(°C)

Maximum

T

CASE

(°C)

Notes

Launch to FMB

80

5

See

Figure 6-1

;

Table 6-2

1, 2, 3, 4, 5, 6

Section	Page
1 Introduction	9
1.1 Terminology	11
1.2 State of Data	13
1.3 References	13
2 Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	17
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	18
2.4.2 PLL Power Supply	19
2.5 Voltage Identification (VID)	19
2.6 Reserved, Unused, or Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	33
2.13.3 Die Voltage Validation	34
2.14 AGTL+ FSB Specifications	34
3 Mechanical Specifications	39
3.1 Package Mechanical Drawings	39
3.2 Processor Component Keepout Zones	43
3.3 Package Loading Specifications	43
3.4 Package Handling Guidelines	44
3.5 Package Insertion Specifications	44
3.6 Processor Mass Specifications	44
3.7 Processor Materials	44
3.8 Processor Markings	45
3.9 Processor Land Coordinates	45
4 Land Listing	49
4.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments	49
4.1.1 Land Listing by Land Name	49
4.1.2 Land Listing by Land Number	60
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	83
6.2 Processor Thermal Features	84
6.2.1 Thermal Monitor Features	84
6.2.2 Thermal Monitor (TM1)	84
6.2.3 Thermal Monitor 2	85
6.2.4 On-Demand Mode	86
6.2.5 PROCHOT# Signal	87
6.2.6 FORCEPR# Signal	87
6.2.7 THERMTRIP# Signal	88
6.3 Platform Environment Control Interface (PECI)	88
6.3.1 Introduction	88
6.3.2 PECI Specifications	89
7 Features	91
7.1 Power-On Configuration Options	91
7.2 Clock Control and Low Power States	91
7.2.1 Normal State	92
7.2.2 HALT or Extended HALT State	92
7.2.3 Stop-Grant State	94
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	94
7.3 Enhanced Intel SpeedStep® Technology	95
8 Boxed Processor Specifications	97
8.1 Introduction	97
8.2 Mechanical Specifications	99
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	99
8.2.2 Boxed Processor Heat Sink Weight	107
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	107
8.3 Electrical Requirements	107
8.3.1 Fan Power Supply (Active CEK)	107
8.3.2 Boxed Processor Cooling Requirements	108
8.4 Boxed Processor Contents	109
9 Debug Tools Specifications	111
9.1 Debug Port System Requirements	111
9.2 Target System Implementation	111
9.2.1 System Implementation	111
9.3 Logic Analyzer Interface (LAI)	111
9.3.1 Mechanical Considerations	112

Intel E5345 Data Sheet - Page 80

Table 6-1., Quad-Core Intel® Xeon® Processor E5300 Series Thermal Specifications

Page 80 highlights