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Intel E5345 Data Sheet - Page 98

Boxed Quad-Core Intel® Xeon® Processor 5300 Series 2U Passive Heat Sink

UPC - 735858191418

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Boxed Processor Specifications Figure 8-2. Boxed Quad-Core Intel® Xeon® Processor 5300 Series 2U Passive Heat Sink Figure 8-3. 2U Passive Quad-Core Intel® Xeon® Processor 5300 Series Processor Thermal Solution (Exploded View) Heat sink screws Heat sink screw springs Heat sink Heat sink standoffs Thermal Interface Material Motherboard and processor Protective Tape CEK spring Chassis pan Note: 1. The heat sinks and fan assemblies represented in Figure 8-1, Figure 8-2, and Figure 8-3 are for reference only, and may not represent the final boxed processor heat sinks. 2. The screws, springs, and standoffs will be captive to the heat sink. This image shows all of the components in an exploded view. 3. It is intended that the CEK spring will ship with the base board and be pre-attached prior to shipping. 98 Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

Section	Page
1 Introduction	9
1.1 Terminology	11
1.2 State of Data	13
1.3 References	13
2 Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	17
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	18
2.4.2 PLL Power Supply	19
2.5 Voltage Identification (VID)	19
2.6 Reserved, Unused, or Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	33
2.13.3 Die Voltage Validation	34
2.14 AGTL+ FSB Specifications	34
3 Mechanical Specifications	39
3.1 Package Mechanical Drawings	39
3.2 Processor Component Keepout Zones	43
3.3 Package Loading Specifications	43
3.4 Package Handling Guidelines	44
3.5 Package Insertion Specifications	44
3.6 Processor Mass Specifications	44
3.7 Processor Materials	44
3.8 Processor Markings	45
3.9 Processor Land Coordinates	45
4 Land Listing	49
4.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments	49
4.1.1 Land Listing by Land Name	49
4.1.2 Land Listing by Land Number	60
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	83
6.2 Processor Thermal Features	84
6.2.1 Thermal Monitor Features	84
6.2.2 Thermal Monitor (TM1)	84
6.2.3 Thermal Monitor 2	85
6.2.4 On-Demand Mode	86
6.2.5 PROCHOT# Signal	87
6.2.6 FORCEPR# Signal	87
6.2.7 THERMTRIP# Signal	88
6.3 Platform Environment Control Interface (PECI)	88
6.3.1 Introduction	88
6.3.2 PECI Specifications	89
7 Features	91
7.1 Power-On Configuration Options	91
7.2 Clock Control and Low Power States	91
7.2.1 Normal State	92
7.2.2 HALT or Extended HALT State	92
7.2.3 Stop-Grant State	94
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	94
7.3 Enhanced Intel SpeedStep® Technology	95
8 Boxed Processor Specifications	97
8.1 Introduction	97
8.2 Mechanical Specifications	99
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	99
8.2.2 Boxed Processor Heat Sink Weight	107
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	107
8.3 Electrical Requirements	107
8.3.1 Fan Power Supply (Active CEK)	107
8.3.2 Boxed Processor Cooling Requirements	108
8.4 Boxed Processor Contents	109
9 Debug Tools Specifications	111
9.1 Debug Port System Requirements	111
9.2 Target System Implementation	111
9.2.1 System Implementation	111
9.3 Logic Analyzer Interface (LAI)	111
9.3.1 Mechanical Considerations	112