Intel E5345 Data Sheet - Page 43

Mechanical Specifications 3.2 Processor Component Keepout Zones The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keepout zones. Decoupling capacitors are typically mounted to either the topside or landside of the package substrate. See Figure 3-4 for keepout zones. 3.3 Package Loading Specifications Table 3-1 provides dynamic and static load specifications for the processor package. These mechanical load limits should not be exceeded during heatsink assembly, mechanical stress testing or standard drop and shipping conditions. The heatsink attach solutions must not include continuous stress onto the processor with the exception of a uniform load to maintain the heatsink-to-processor thermal interface. Also, any mechanical system or component testing should not exceed these limits. The processor package substrate should not be used as a mechanical reference or loadbearing surface for thermal or mechanical solutions. Table 3-1. Package Loading Specifications Parameter Static Compressive Load Dynamic Compressive Load Board Thickness 1.57 mm 0.062" 2.16 mm 0.085" 2.54 mm 0.100" NA Min 80 18 111 25 133 30 NA Max 311 70 311 70 311 70 311 N (max static compressive load) + 222 N dynamic loading Unit N lbf N lbf N lbf N Notes 1,2,3,9 1,3,4,5,6 Transient Bend Limits 1.57 mm 0.062" 70 lbf (max static lbf compressive load) + 50 lbf dynamic loading NA 750 me 1,3,7,8 Notes: 1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface. 2. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface. 3. These specifications are based on limited testing for design characterization. Loading limits are for the LGA771 socket. 4. Dynamic compressive load applies to all board thickness. 5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. 6. Test condition used a heatsink mass of 1 lbm with 50 g acceleration measured at heatsink mass. The dynamic portion of this specification in the product application can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this dynamic load. 7. Transient bend is defined as the transient board deflection during manufacturing such as board assembly and system integration. It is a relatively slow bending event compared to shock and vibration tests. 8. For more information on the transient bend limits, please refer to the MAS document entitled Manufacturing with Intel® Components using 771-land LGA Package that Interfaces with the Motherboard via a LGA771 Socket. 9. Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines for information on heatsink clip load metrology. Quad-Core Intel® Xeon® Processor 5300 Series Datasheet 43