Intel E5345 Data Sheet - Page 79

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

79

Thermal Specifications

6


6.1

Package Thermal Specifications

The Quad-Core Intel® Xeon® Processor 5300 Series requires a thermal solution to

maintain temperatures within its operating limits. Any attempt to operate the processor

outside these operating limits may result in permanent damage to the processor and

potentially other components within the system. As processor technology changes,

thermal management becomes increasingly crucial when building computer systems.

Maintaining the proper thermal environment is key to reliable, long-term system

operation.

A complete solution includes both component and system level thermal management

features. Component level thermal solutions can include active or passive heatsinks

attached to the processor integrated heat spreader (IHS). Typical system level thermal

solutions may consist of system fans combined with ducting and venting.

This section provides data necessary for developing a complete thermal solution. For

more information on designing a component level thermal solution, refer to the

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design

Guidelines

.

Note:

The boxed processor will ship with a component thermal solution. Refer to

Section 8

for

details on the boxed processor.

6.1.1


To allow the optimal operation and long-term reliability of Intel processor-based

systems, the processor must remain within the minimum and maximum case

temperature (T

CASE

) specifications as defined by the applicable thermal profile (see

Table 6-1

and

Figure 6-1

for Quad-Core Intel® Xeon® Processor E5300 Series and

Table 6-3

and

Figure 6-2

for Quad-Core Intel® Xeon® Processor X5300 Series).

Thermal solutions not designed to provide this level of thermal capability may affect the

long-term reliability of the processor and system. For more details on thermal solution

design, please refer to the

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/

Mechanical Design Guidelines

.

The Quad-Core Intel® Xeon® Processor 5300 Series implement a methodology for

managing processor temperatures which is intended to support acoustic noise

reduction through fan speed control and to assure processor reliability. Selection of the

appropriate fan speed is based on the relative temperature data reported by the

processor’s Platform Environment Control Interface (PECI) bus as described in

Section 6.3

. The temperature reported over PECI is always a negative value and

represents a delta below the onset of thermal control circuit (TCC) activation, as

indicated by PROCHOT# (see

Section 6.2

, Processor Thermal Features). Systems that

implement fan speed control must be designed to use this data. Systems that do not

alter the fan speed only need to guarantee the case temperature meets the thermal

profile specifications.

The Quad-Core Intel® Xeon® Processor E5300 Series (see

Figure 6-1

;

Table 6-2

)

supports a single Thermal Profile. For these processors, it is expected that the Thermal

Control Circuit (TCC) would only be activated for very brief periods of time when

Section	Page
1 Introduction	9
1.1 Terminology	11
1.2 State of Data	13
1.3 References	13
2 Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	17
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	18
2.4.2 PLL Power Supply	19
2.5 Voltage Identification (VID)	19
2.6 Reserved, Unused, or Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	33
2.13.3 Die Voltage Validation	34
2.14 AGTL+ FSB Specifications	34
3 Mechanical Specifications	39
3.1 Package Mechanical Drawings	39
3.2 Processor Component Keepout Zones	43
3.3 Package Loading Specifications	43
3.4 Package Handling Guidelines	44
3.5 Package Insertion Specifications	44
3.6 Processor Mass Specifications	44
3.7 Processor Materials	44
3.8 Processor Markings	45
3.9 Processor Land Coordinates	45
4 Land Listing	49
4.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments	49
4.1.1 Land Listing by Land Name	49
4.1.2 Land Listing by Land Number	60
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	83
6.2 Processor Thermal Features	84
6.2.1 Thermal Monitor Features	84
6.2.2 Thermal Monitor (TM1)	84
6.2.3 Thermal Monitor 2	85
6.2.4 On-Demand Mode	86
6.2.5 PROCHOT# Signal	87
6.2.6 FORCEPR# Signal	87
6.2.7 THERMTRIP# Signal	88
6.3 Platform Environment Control Interface (PECI)	88
6.3.1 Introduction	88
6.3.2 PECI Specifications	89
7 Features	91
7.1 Power-On Configuration Options	91
7.2 Clock Control and Low Power States	91
7.2.1 Normal State	92
7.2.2 HALT or Extended HALT State	92
7.2.3 Stop-Grant State	94
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	94
7.3 Enhanced Intel SpeedStep® Technology	95
8 Boxed Processor Specifications	97
8.1 Introduction	97
8.2 Mechanical Specifications	99
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	99
8.2.2 Boxed Processor Heat Sink Weight	107
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	107
8.3 Electrical Requirements	107
8.3.1 Fan Power Supply (Active CEK)	107
8.3.2 Boxed Processor Cooling Requirements	108
8.4 Boxed Processor Contents	109
9 Debug Tools Specifications	111
9.1 Debug Port System Requirements	111
9.2 Target System Implementation	111
9.2.1 System Implementation	111
9.3 Logic Analyzer Interface (LAI)	111
9.3.1 Mechanical Considerations	112

Intel E5345 Data Sheet - Page 79

Thermal Specifications

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