Intel X5472 Mechanical Design Guidelines

Intel X5472 - Cpu Xeon Quad Core 3.00Ghz Fsb1600Mhz 12M Lga771 Tray Manual

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  • Intel X5472 | Mechanical Design Guidelines - Page 1
    Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines November 2007 Reference Number: 318611 Revision: 001
  • Intel X5472 | Mechanical Design Guidelines - Page 2
    conflicts or incompatibilities arising from future changes to them. The Quad-Core Intel® Xeon® 5400 Series may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request. Contact your
  • Intel X5472 | Mechanical Design Guidelines - Page 3
    ...83 C.2 Test Preparation 83 C.2.1 Heatsink Preparation 83 C.2.2 Typical Test Equipment 86 C.2.3 Test Procedure Examples 86 C.2.4 Time-Zero, Room Temperature Preload Measurement 86 C.2.5 Preload Degradation under Bake Conditions 87 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3
  • Intel X5472 | Mechanical Design Guidelines - Page 4
    Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3 16 2-3 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3 17 2-4 Processor Case Temperature Measurement Location 19 2-5 DTS Domain for Quad-Core Intel® Xeon® Processor 5400 Series 21 2-6 Processor Core
  • Intel X5472 | Mechanical Design Guidelines - Page 5
    Cell Installation in Machined Heatsink Base Pocket - Bottom View 84 Load Cell Installation in Machined Heatsink Base Pocket - Side View 85 Preload Test Configuration 85 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 5
  • Intel X5472 | Mechanical Design Guidelines - Page 6
    Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor E5400 Series 32 2-6 Fan Speed Control, TCONTROL and DTS Relationship 34 2-7 CEK Heatsink Thermal Mechanical Characteristics 47 2-8 Recommended Thermal Grease Dispense Weight 47 2-9 Fan Specifications (Boxed 4-wire PWM/DTS
  • Intel X5472 | Mechanical Design Guidelines - Page 7
    Revision History Reference Number 318611 Revision Number 001 Description Initial release of the document. § Date November 2007 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 7
  • Intel X5472 | Mechanical Design Guidelines - Page 8
    8 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 9
    Intel® Xeon® Processor-Based Workstation Platform Design Guide (PDG) Clovertown, Harpertown & Wolfdale-DP Processors Compatibility Design Guide for Bensley, Bensley-VS, and Glidewell Platforms PECI Feature Set Overview Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon
  • Intel X5472 | Mechanical Design Guidelines - Page 10
    in a component specification. Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. 10 Quad-Core Intel® Xeon® Processor 5400
  • Intel X5472 | Mechanical Design Guidelines - Page 11
    . The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § Quad-Core Intel® Xeon® Processor 5400 Series TMDG 11
  • Intel X5472 | Mechanical Design Guidelines - Page 12
    Introduction 12 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 13
    3 3 3 2,4,5 2,4,6 2,4,7 Notes: 1. Refer to drawings in Appendix B. 2. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5400 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Table 2-1 above. 3. These socket limits are defined in the
  • Intel X5472 | Mechanical Design Guidelines - Page 14
    the Quad-Core Intel® Xeon® Processor 5400 Series. The drawing is superseded with the drawing in the processor datasheet should there be any conflicts. Integrated package/ socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide. 14 Quad-Core Intel® Xeon® Processor
  • Intel X5472 | Mechanical Design Guidelines - Page 15
    -Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3) Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution are available in the processor Thermal/Mechanical Design Guidelines. Quad-Core Intel® Xeon® Processor
  • Intel X5472 | Mechanical Design Guidelines - Page 16
    Thermal/Mechanical Reference Design Figure 2-2. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3) 16 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 17
    /Mechanical Reference Design Figure 2-3. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3) Note: The optional dimple packing marking highlighted by Detail F from the above drawing may only be found on initial processors. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 17
  • Intel X5472 | Mechanical Design Guidelines - Page 18
    the socket can be found in the LGA771 Socket Mechanical Design Guide. The processor package and socket have mechanical load limits that are specified in the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet and the LGA771 Socket Mechanical Design Guide. These load limits should not be exceeded
  • Intel X5472 | Mechanical Design Guidelines - Page 19
    for the Quad-Core Intel® Xeon® Processor 5400 Series package. Compliance with the TCASE specification is required to achieve optimal operation and long-term reliability (See the Intel® Xeon® Dual- and Multi- Processor Family Thermal Test Vehicle User's Guide for Case Temperature definition and
  • Intel X5472 | Mechanical Design Guidelines - Page 20
    to support the continued increases in processor frequency and performance. Please see the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for guidance on these thermal management features. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5400 Series include on-die temperature
  • Intel X5472 | Mechanical Design Guidelines - Page 21
    receives the highest of the DTS output temperatures within each domain. Figure 2-5 provides an illustration of the DTS domains for the Quad-Core Intel® Xeon® Processor 5400 Series. DTS Domain for Quad-Core Intel® Xeon® Processor 5400 Series Quad-Core Intel® Xeon® Processor 5400 Series TMDG 21
  • Intel X5472 | Mechanical Design Guidelines - Page 22
    for information on TCONTROL. The PECI signal is available through CPU pin (G5) on each LGA771 socket for the Quad-Core Intel® Xeon® Processor 5400 Series. Through this pin, the two domains provide the current hottest value received from all the temperature sensors, to an external PECI device such as
  • Intel X5472 | Mechanical Design Guidelines - Page 23
    Y3 Y2 Y1 Core4 Core3 Core2 Core1 X1, X2, X3, X4 Y X Table 2-3. Processor Core Geometric Center Dimensions Feature Core 1 Core 2 Core 3 Core 4 X Dimension 18.15 mm 18.15 mm 18.15 mm 18.15 mm Y Dimension 6.15 mm 10.35 mm 18.85 mm 23.05 mm Quad-Core Intel® Xeon® Processor 5400 Series TMDG 23
  • Intel X5472 | Mechanical Design Guidelines - Page 24
    Thermal Profile. If the case-to-ambient resistance and the local ambient temperature are known for a specific thermal solution, the Thermal Profile of that solution can easily be plotted against the Thermal Profile specification. As explained 24 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 25
    Temperature 0 Tcontrol = -5 -10 Temperature -20 -30 -40 Time The value for TCONTROL is calibrated in manufacturing and configured for each processor individually. For the Quad-Core Intel® Xeon® Processor 5400 Series, the TCONTROL value is obtained by reading the processor model specific
  • Intel X5472 | Mechanical Design Guidelines - Page 26
    factors (i.e. airflow, thermal solution height), it is very challenging to meet the thermal requirements of the processor. To mitigate these form factor constraints, Intel has developed a dual Thermal Profile specification, shown in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 27
    timeframe. One example of a worst-case thermal condition is when a processor local ambient temperature is at or above 42.8°C for Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A. Thermal Profile B supports volumetrically constrained platforms (i.e. 1U, blades, etc.), and is based on
  • Intel X5472 | Mechanical Design Guidelines - Page 28
    example of a worst-case thermal condition is when a processor local ambient temperature is at or above 43.2°C for Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile. Thermal solutions that exceed the Thermal Profile specification are considered incompliant and will adversely affect the
  • Intel X5472 | Mechanical Design Guidelines - Page 29
    for the Quad-Core Intel® Xeon® Processor X5400 Series Notes: 1. The The thermal specifications shown in this graph are for Quad-Core Intel® Xeon® Processor X5400 Series except the Quad-Core Intel® Xeon® Processor X5482 sku. 2. Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
  • Intel X5472 | Mechanical Design Guidelines - Page 30
    Design Figure 2-12. Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series Note: The thermal specifications shown in this graph are for reference only. Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data
  • Intel X5472 | Mechanical Design Guidelines - Page 31
    Thermal/Mechanical Reference Design Figure 2-13. Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series Tcase [C] Thermal Profile (2U) 75 70 65 60 55 50 Thermal Profile 45 Y = 0.187*x + 35 40 35 0 10 20 30 40 50 60 70
  • Intel X5472 | Mechanical Design Guidelines - Page 32
    Airflow through the heatsink fins Mean + 3σ Note: Intel does not enable reference heatsink for the Quad-Core Intel® Xeon® Processor X5482 with 150W TDP. The Intel 2U CEK is capable of meeting the thermal specification when local ambient temperature (TLA) is maintained at or below 35°C. 2.3 Note
  • Intel X5472 | Mechanical Design Guidelines - Page 33
    as explained earlier, the DTS temperature reading from the processor can be compared to this TCONTROL value. A fan speed control scheme can be implemented as described in Table 2-6 without compromising the long-term reliability of the processor. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 33
  • Intel X5472 | Mechanical Design Guidelines - Page 34
    characterization parameter (°C/W). TCASE = Processor case temperature (°C). TLA = Local ambient temperature in chassis at processor (°C). TDP = TDP dissipation (W) (assumes all power dissipates through the integrated heat spreader (IHS)). 34 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 35
    provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 35
  • Intel X5472 | Mechanical Design Guidelines - Page 36
    W and the case temperature specification is 68 °C. Assume as well that the system airflow has been designed such that the local processor ambient temperature is 45°C. Then the solutions may be appropriate for a particular system implementation. 36 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 37
    the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air, TLA, and the local air velocity over the surface. The higher the method for maximizing airflow through the heatsink fins. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 37
  • Intel X5472 | Mechanical Design Guidelines - Page 38
    useful life of the processor due to the temperature cycling phenomena. For this reason, the measured TCASE value of a given processor can decrease over time depending height information is provided in the LGA771 Socket Mechanical Design Guide. 38 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 39
    Reference Thermal Mechanical Design The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5400 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists
  • Intel X5472 | Mechanical Design Guidelines - Page 40
    make changes and modifications to the design as necessary. The thermal mechanical reference design for the Quad-Core Intel® Xeon® Processor 5400 Series was verified according to the Intel validation criteria given in Appendix E.1. Any thermal mechanical design using some of the reference components
  • Intel X5472 | Mechanical Design Guidelines - Page 41
    meet the loading specification as documented within this document, and should refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet and LGA771 Socket Mechanical Design Guide for specific details on package/socket loading specifications. Quad-Core Intel® Xeon® Processor 5400 Series
  • Intel X5472 | Mechanical Design Guidelines - Page 42
    Quad-Core Intel® Xeon® Processor 5400 Series. From Table 2-4, the threesigma (mean+3sigma) performance of the thermal solution is computed to be 0.187 °C/W and the processor local ambient temperature Profile to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile A specification. The 2U+
  • Intel X5472 | Mechanical Design Guidelines - Page 43
    Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A 65 TCASE_MAX_B@TDP 60 Thermal Profile A 55 Y = 0.168 * X + 42.8 Temperature ( C) solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile specification. The 1U CEK solution meets
  • Intel X5472 | Mechanical Design Guidelines - Page 44
    is designed to meet the Thermal Profile specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From Table 2-7 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.246 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40
  • Intel X5472 | Mechanical Design Guidelines - Page 45
    has also developed an 1U alternative reference heatsink design. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of weight reduction and cost savings. Refer to Appendix B for detail information
  • Intel X5472 | Mechanical Design Guidelines - Page 46
    heatsink load, especially in lateral conditions, when compared to the amount of load transmitted to the processor package. As such, it is comprised of steel. The distance from the bottom of the heatsink correct length of 20.64 mm [0.8125 in.]. 46 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 47
    the heatsink. The retention scheme employed by CEK is designed to support heavy heatsinks (approximately up to 1000 grams) in cases of G751 thermal grease. For guidance with your specific application, please contact the vendor. Vendor Quad-Core Intel® Xeon® Processor 5400 Series TMDG 47
  • Intel X5472 | Mechanical Design Guidelines - Page 48
    detailed mechanical drawings of the CEK spring. Also, the baseboard keepout requirements shown in Appendix B must be met to use this CEK spring design. 48 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 49
    Reference Design 2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile Intel will provide a 2U passive and a 1U passive/active heatsink solution for boxed Quad-Core Intel® Xeon® Processor 5400 Series. This active heatsink solution is primarily
  • Intel X5472 | Mechanical Design Guidelines - Page 50
    matched fan power header to support the boxed processor. Table 2-9 contains specifications for the input and output CPU fan header is used instead, the active fan heatsink solution will revert back to an automatic ambient air temperature control Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 51
    The board must not bend beyond specification in order to avoid damage. The boxed processor contains the components necessary to solve both issues. The boxed processor will include the following items: • Quad-Core Intel® Xeon® Processor 5400 Series • Unattached heatsink solution • 4 screws, 4 springs
  • Intel X5472 | Mechanical Design Guidelines - Page 52
    be shipped with either the chassis or boards. They are as follows: • CEK Spring (supplied by baseboard vendors) • Heatsink standoffs (supplied by chassis vendors) § 52 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 53
    factor and targeted for the rack-optimized and ultra dense SKUs. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of weight reduction and cost savings in using this alternative 1U heatsink. This
  • Intel X5472 | Mechanical Design Guidelines - Page 54
    331 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as: Equation A-1. y = 0.331*x + 40 where, y = Processor TCASE value (°C) 54 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 55
    power value (W) Figure A-3 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin at the upper end (TDP). By designing
  • Intel X5472 | Mechanical Design Guidelines - Page 56
    1U Alternative Heatsink Thermal/Mechanical Design 56 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 57
    Drawings The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Quad-Core Intel® Xeon® Processor 5400 Series. Note: Intel reserves the right to make changes and modifications to the design as necessary. Table B-1. Mechanical Drawing List
  • Intel X5472 | Mechanical Design Guidelines - Page 58
    Figure B-1. 2U CEK Heatsink (Sheet 1 of 4) Mechanical Drawings 58 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 59
    Mechanical Drawings Figure B-2. 2U CEK Heatsink (Sheet 2 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 59
  • Intel X5472 | Mechanical Design Guidelines - Page 60
    Figure B-3. 2U CEK Heatsink (Sheet 3 of 4) Mechanical Drawings 60 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 61
    Mechanical Drawings Figure B-4. 2U CEK Heatsink (Sheet 4 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 61
  • Intel X5472 | Mechanical Design Guidelines - Page 62
    Figure B-5. CEK Spring (Sheet 1 of 3) Mechanical Drawings 62 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 63
    Mechanical Drawings Figure B-6. CEK Spring (Sheet 2 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 63
  • Intel X5472 | Mechanical Design Guidelines - Page 64
    Figure B-7. CEK Spring (Sheet 3 of 3) Mechanical Drawings 64 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 65
    Mechanical Drawings Figure B-8. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 65
  • Intel X5472 | Mechanical Design Guidelines - Page 66
    Mechanical Drawings Figure B-9. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6) 66 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 67
    Mechanical Drawings Figure B-10. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 67
  • Intel X5472 | Mechanical Design Guidelines - Page 68
    Mechanical Drawings Figure B-11. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6) 68 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 69
    Mechanical Drawings Figure B-12. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 69
  • Intel X5472 | Mechanical Design Guidelines - Page 70
    Mechanical Drawings Figure B-13. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6) 70 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 71
    Mechanical Drawings Figure B-14. 1U CEK Heatsink (Sheet 1 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 71
  • Intel X5472 | Mechanical Design Guidelines - Page 72
    Figure B-15. 1U CEK Heatsink (Sheet 2 of 4) Mechanical Drawings 72 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 73
    Mechanical Drawings Figure B-16. 1U CEK Heatsink (Sheet 3 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 73
  • Intel X5472 | Mechanical Design Guidelines - Page 74
    Figure B-17. 1U CEK Heatsink (Sheet 4 of 4) Mechanical Drawings 74 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 75
    Mechanical Drawings Figure B-18. Active CEK Thermal Solution Volumetric (Sheet 1 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 75
  • Intel X5472 | Mechanical Design Guidelines - Page 76
    Mechanical Drawings Figure B-19. Active CEK Thermal Solution Volumetric (Sheet 2 of 3) 76 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 77
    Mechanical Drawings Figure B-20. Active CEK Thermal Solution Volumetric (Sheet 3 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 77
  • Intel X5472 | Mechanical Design Guidelines - Page 78
    Figure B-21. 1U Alternative Heatsink (1 of 4) Mechanical Drawings 78 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 79
    Mechanical Drawings Figure B-22. 1U Alternative Heatsink (2 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 79
  • Intel X5472 | Mechanical Design Guidelines - Page 80
    Figure B-23. 1U Alternative Heatsink (3 of 4) Mechanical Drawings 80 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 81
    Mechanical Drawings Figure B-24. 1U Alternative Heatsink (4 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 81
  • Intel X5472 | Mechanical Design Guidelines - Page 82
    Mechanical Drawings § 82 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 83
    for the LGA771 socket. • Quantify preload degradation under bake conditions. This document reflects the current metrology used by Intel. Intel is whole assembly stiffness (i.e. motherboard, clip, fastener, etc.). For example, the Quad-Core Intel® Xeon® Processor 5400 Series CEK Reference
  • Intel X5472 | Mechanical Design Guidelines - Page 84
    C-1. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View Heatsink Base Pocket Diameter ~ 29 mm [~1.15"] Package IHS Outline (Top Surface) Load Cells 84 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 85
    Height of pocket ~ height of selected load cell Wax to maintain load cell in position during heatsink installation Figure C-3. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x) Quad-Core Intel® Xeon® Processor 5400 Series TMDG 85
  • Intel X5472 | Mechanical Design Guidelines - Page 86
    instructions. C.2.4 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support the load cells to motherboard as shown for the Quad-Core Intel® Xeon® Processor 5400 Series CEK-reference
  • Intel X5472 | Mechanical Design Guidelines - Page 87
    = 0.1 Hz for first 3 hrs Sample rate = 0.01 Hz for the remainder of the bake test 5. Remove assembly from thermal chamber and set into room temperature conditions 6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz. § Quad-Core Intel® Xeon® Processor 5400 Series TMDG 87
  • Intel X5472 | Mechanical Design Guidelines - Page 88
    Heatsink Clip Load Methodology 88 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 89
    -2 approved. 2. CSA Certification. All mechanical and thermal enabling components must have CSA certification. 3. Heatsink fins must meet the test requirements of UL1439 for sharp edges. § Quad-Core Intel® Xeon® Processor 5400 Series TMDG 89
  • Intel X5472 | Mechanical Design Guidelines - Page 90
    Safety Requirements 90 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 91
    , and associated stress tests, can be found in the LGA771 Socket Mechanical Design Guide. The use condition environment definitions provided in Appendix E-1are based on speculative use condition assumptions, and are provided as examples only. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 91
  • Intel X5472 | Mechanical Design Guidelines - Page 92
    : In the case of a discrepancy, information in the most recent LGA771 Socket Mechanical Design Guidelines supersedes that in the Table E-1 above. base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 92 Quad-Core Intel® Xeon® Processor 5400 Series
  • Intel X5472 | Mechanical Design Guidelines - Page 93
    6. Thermal compliance testing to demonstrate that the case temperature specification can be met. Recommended BIOS/Processor/Memory Test Procedures This test is to ensure proper implementation details are not fully defined and may change. § Quad-Core Intel® Xeon® Processor 5400 Series TMDG 93
  • Intel X5472 | Mechanical Design Guidelines - Page 94
    Quality and Reliability Requirements 94 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
  • Intel X5472 | Mechanical Design Guidelines - Page 95
    Table F-1. For additional details, please refer to the Quad-Core Intel® Xeon® Processor 5400 Series thermal mechanical enabling components drawings in Appendix B. Table F-1. Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2) Assembly CEK771-01-2U
  • Intel X5472 | Mechanical Design Guidelines - Page 96
    1U alternative reference heatsink design for Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form factors. F.1.2 Additional Suppliers The Intel enabled solutions for Quad-Core Intel® Xeon® Processor 5400 Series are preliminary. The Intel enabled solutions have not been
  • Intel X5472 | Mechanical Design Guidelines - Page 97
    Enabled Suppliers Information Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2) Assembly 2U Heatsink Component Alternative CEK Heatsink Description Copper Fin, Copper Base Development Suppliers Aavid Thermalloy CNDA#
  • Intel X5472 | Mechanical Design Guidelines - Page 98
    Enabled Suppliers Information Table F-2. Assembly 1U Heatsink Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 2 of 2) Component Alternative CEK Heatsink Description Copper Fin, Copper Base Development Suppliers Aavid Thermalloy CNDA#
  • Intel X5472 | Mechanical Design Guidelines - Page 99
    Enabled Suppliers Information § Quad-Core Intel® Xeon® Processor 5400 Series TMDG 99
  • Intel X5472 | Mechanical Design Guidelines - Page 100
    Enabled Suppliers Information 100 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
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Reference Number: 318611 Revision: 001
Quad-Core Intel
®
Xeon
®
Processor
5400 Series
Thermal/Mechanical Design Guidelines
November 2007