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Intel X5472 Mechanical Design Guidelines - Page 43

Equation 2-9.y = 0.246*X + 40

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Thermal/Mechanical Reference Design Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A 65 TCASE_MAX_B@TDP 60 Thermal Profile A 55 Y = 0.168 * X + 42.8 Temperature ( C) 50 2U CEK Reference Solution Y = 0.187 * X + 40 45 40 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 90 100 110 120 Power (W) TDP The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad-Core Intel® Xeon® Processor X5400 Series. From Table 2-7 the threesigma (mean+3sigma) performance of the thermal solution is computed to be 0.246°C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as: Equation 2-9.y = 0.246*X + 40 where, y = Processor TCASE value (°C) x = Processor power value (W) Figure 2-20 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile B with 0.5°C margin at the upper end (TDP). However, as explained in Section 2.2.7, designing to Thermal Profile B results in increased TCC activation and measurable performance loss for the processor. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 43

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations	18
2.2 Processor Thermal Parameters and Features	19
2.2.1 Thermal Control Circuit and TDP	19
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	21
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series	26
2.2.8 Performance Targets	28
2.3 Fan Fail Guidelines	32
2.4 Characterizing Cooling Solution Performance Requirements	33
2.4.1 Fan Speed Control	33
2.4.2 Processor Thermal Characterization Parameter Relationships	34
2.4.3 Chassis Thermal Design Considerations	36
2.5 Thermal/Mechanical Reference Design Considerations	37
2.5.1 Heatsink Solutions	37
2.5.2 Thermal Interface Material	38
2.5.3 Summary	38
2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	39
2.5.5 Thermal Solution Performance Characteristics	41
2.5.6 Thermal Profile Adherence	42
2.5.7 Components Overview	45
2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile	49
A 1U Alternative Heatsink Thermal/Mechanical Design	53
A.1 Component Overview	53
A.2 Thermal Solution Performance Characterics	54
A.3 Thermal Profile Adherence	54
B Mechanical Drawings	57
C Heatsink Clip Load Methodology	83
C.1 Overview	83
C.2 Test Preparation	83
C.2.1 Heatsink Preparation	83
C.2.2 Typical Test Equipment	86
C.2.3 Test Procedure Examples	86
C.2.4 Time-Zero, Room Temperature Preload Measurement	86
C.2.5 Preload Degradation under Bake Conditions	87
D Safety Requirements	89
E Quality and Reliability Requirements	91
E.1 Intel Verification Criteria for the Reference Designs	91
E.1.1 Reference Heatsink Thermal Verification	91
E.1.2 Environmental Reliability Testing	91
E.1.3 Material and Recycling Requirements	93
F Enabled Suppliers Information	95
F.1 Supplier Information	95
F.1.1 Intel Enabled Suppliers	95