Intel X5472 Mechanical Design Guidelines - Page 28

Thermal/Mechanical Reference Design

28

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Refer to the

Quad-Core Intel® Xeon® Processor 5400 Series Datasheet

or

Section 2.2.8

for the Thermal Profile A and Thermal Profile B specifications.

Section 2.5

of this document also provides details on the 2U+ and 1U Intel reference thermal

solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5400

Series Thermal Profile A and Thermal Profile B respectively.

2.2.7.2

Thermal Profile Concept for the

Quad-Core Intel® Xeon® Processor

E5400/X5482 Series

The Quad-Core Intel® Xeon® Processor E5400 Series is designed to go into various

form factors, including the volumetrically constrained 1U and custom blade form

factors. The Quad-Core Intel® Xeon® Processor X5482 is designed to go into

volumetrically unconstrained workstation platforms only. Intel has developed single

thermal profile for E5400/X5482 Series.

Designing to the Thermal Profile ensures that no measurable performance loss due to

Thermal Control Circuit (TCC) activation is observed in the processor. It is expected

that TCC would only be activated for very brief periods of time when running a worst-

case real world application in a worst-case thermal condition. These brief instances of

TCC activation are not expected to impact the performance of the processor. A worst

case real world application is defined as a commercially available, useful application

which dissipates a power equal to, or above, the TDP for a thermally relevant

timeframe. One example of a worst-case thermal condition is when a processor local

ambient temperature is at or above 43.2°C for Quad-Core Intel® Xeon® Processor

E5400 Series Thermal Profile.

Thermal solutions that exceed the Thermal Profile specification are considered

incompliant and will adversely affect the long-term reliability of the processor.

Refer to the

Quad-Core Intel® Xeon® Processor 5400 Series Datasheet

or

Section 2.2.8

for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile

specifications.

Section 2.5

and

Appendix A

of this document provide details on 1U Intel

reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon®

Processor E5400 Series Thermal Profile.

2.2.8

Performance Targets

The Thermal Profile specifications for this processor are published in the

Quad-Core

Intel® Xeon® Processor 5400 Series Datasheet.

These Thermal Profile specifications

are shown as a reference in the subsequent discussions.

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations	18
2.2 Processor Thermal Parameters and Features	19
2.2.1 Thermal Control Circuit and TDP	19
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	21
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series	26
2.2.8 Performance Targets	28
2.3 Fan Fail Guidelines	32
2.4 Characterizing Cooling Solution Performance Requirements	33
2.4.1 Fan Speed Control	33
2.4.2 Processor Thermal Characterization Parameter Relationships	34
2.4.3 Chassis Thermal Design Considerations	36
2.5 Thermal/Mechanical Reference Design Considerations	37
2.5.1 Heatsink Solutions	37
2.5.2 Thermal Interface Material	38
2.5.3 Summary	38
2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	39
2.5.5 Thermal Solution Performance Characteristics	41
2.5.6 Thermal Profile Adherence	42
2.5.7 Components Overview	45
2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile	49
A 1U Alternative Heatsink Thermal/Mechanical Design	53
A.1 Component Overview	53
A.2 Thermal Solution Performance Characterics	54
A.3 Thermal Profile Adherence	54
B Mechanical Drawings	57
C Heatsink Clip Load Methodology	83
C.1 Overview	83
C.2 Test Preparation	83
C.2.1 Heatsink Preparation	83
C.2.2 Typical Test Equipment	86
C.2.3 Test Procedure Examples	86
C.2.4 Time-Zero, Room Temperature Preload Measurement	86
C.2.5 Preload Degradation under Bake Conditions	87
D Safety Requirements	89
E Quality and Reliability Requirements	91
E.1 Intel Verification Criteria for the Reference Designs	91
E.1.1 Reference Heatsink Thermal Verification	91
E.1.2 Environmental Reliability Testing	91
E.1.3 Material and Recycling Requirements	93
F Enabled Suppliers Information	95
F.1 Supplier Information	95
F.1.1 Intel Enabled Suppliers	95

Intel X5472 Mechanical Design Guidelines - Page 28

Performance Targets - x5482 core temperature

Page 28 highlights