Intel X5472 Mechanical Design Guidelines - Page 10

Introduction Table 1-1. Reference Documents (Sheet 2 of 2) Document Comment Clovertown_Harpertown_Wolfdale-DP Processor Enabled Components CEK Thermal Models (in Flotherm* and Icepak*) Clovertown_Harpertown_Wolfdale-DP Processor Package Thermal Models (in Flotherm and Icepak) RS - Wolfdale Processor Family BIOS Writers Guide (BWG) Thin Electronics Bay Specification (A Server System Infrastructure (SSI) Specification for Rack Optimized Servers Available electronically Available electronically See Note following table. www.ssiforum.com Note: Contact your Intel field sales representative for the latest revision and order number of this document. 1.4 Definition of Terms Table 1-2. Terms and Descriptions (Sheet 1 of 2) Term Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE TCASE_MAX TCC Description Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. Digital Thermal Sensor replaces the Tdiode in previous products and uses the same sensor as the PROCHOT# sensor to indicate the on-die temperature. The temperature value represents the number of degrees below the TCC activation temperature. The processor provides a variety of model specific registers that are used to control and report on processor performance. Virtually all MSRs handle system related functions and are not accessible to an application program. Flexible Motherboard Guideline: an estimate of the maximum value of a processor specification over certain time periods. System designers should meet the FMB values to ensure their systems are compatible with future processor releases. Fan Speed Control Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. The Quad-Core Intel® Xeon® Processor 5400 Series interfaces to the baseboard through this surface mount, 771 Land socket. See the LGA771 Socket Mechanical Design Guide for details regarding this socket. The maximum power dissipated by a semiconductor component. A proprietary one-wire bus interface that provides a communication channel between Intel processor and chipset components to external thermal monitoring devices, for use in fan speed control. PECI communicates readings from the processors Digital Thermal Sensor. PECI replaces the thermal diode available in previous processors. Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (TCASE - TLA) / Total Package Power. Heat source should always be specified for Ψ measurements. Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TCASE - TS) / Total Package Power. Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS - TLA) / Total Package Power. The case temperature of the processor, measured at the geometric center of the topside of the IHS. The maximum case temperature as specified in a component specification. Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. 10 Quad-Core Intel® Xeon® Processor 5400 Series TMDG