Intel X5472 Mechanical Design Guidelines - Page 46

Thermal/Mechanical Reference Design

46

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Note:

Refer to

Appendix B

for more detailed mechanical drawings of the heatsink.

.

Note:

Refer to

Appendix B

for more detailed mechanical drawings of the heatsink.

The function of the standoffs is to provide a bridge between the chassis and the

heatsink for attaching and load carrying. When assembled, the heatsink is rigid against

the top of the standoff, and the standoff is rigid to a chassis standoff with the CEK

spring firmly sandwiched between the two. In dynamic loading situations the standoff

carries much of the heatsink load, especially in lateral conditions, when compared to

the amount of load transmitted to the processor package. As such, it is comprised of

steel. The distance from the bottom of the heatsink to the bottom of the standoff is

8.79 mm [0.346 in.] for a board thickness of 1.57 mm [0.062 in].

The standoff will

need to be modified for use in applications with a different board thickness, as defined

in

Section 2.5.4.2

.

The function of the screw is to provide a rigid attach method to sandwich the entire CEK

assembly together, activating the CEK spring under the baseboard, and thus providing

the TIM preload. A screw is an inexpensive, low profile solution that does not negatively

impact the thermal performance of the heatsink due to air blockage. Any fastener

(i.e. head configuration) can be used as long as it is of steel construction; the head

does not interfere with the heatsink fins, and is of the correct length of 20.64 mm

[0.8125 in.].

Figure 2-22. Isometric View of the 2U+ CEK Heatsink

Figure 2-23. Isometric View of the 1U CEK Heatsink

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations	18
2.2 Processor Thermal Parameters and Features	19
2.2.1 Thermal Control Circuit and TDP	19
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	21
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series	26
2.2.8 Performance Targets	28
2.3 Fan Fail Guidelines	32
2.4 Characterizing Cooling Solution Performance Requirements	33
2.4.1 Fan Speed Control	33
2.4.2 Processor Thermal Characterization Parameter Relationships	34
2.4.3 Chassis Thermal Design Considerations	36
2.5 Thermal/Mechanical Reference Design Considerations	37
2.5.1 Heatsink Solutions	37
2.5.2 Thermal Interface Material	38
2.5.3 Summary	38
2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	39
2.5.5 Thermal Solution Performance Characteristics	41
2.5.6 Thermal Profile Adherence	42
2.5.7 Components Overview	45
2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile	49
A 1U Alternative Heatsink Thermal/Mechanical Design	53
A.1 Component Overview	53
A.2 Thermal Solution Performance Characterics	54
A.3 Thermal Profile Adherence	54
B Mechanical Drawings	57
C Heatsink Clip Load Methodology	83
C.1 Overview	83
C.2 Test Preparation	83
C.2.1 Heatsink Preparation	83
C.2.2 Typical Test Equipment	86
C.2.3 Test Procedure Examples	86
C.2.4 Time-Zero, Room Temperature Preload Measurement	86
C.2.5 Preload Degradation under Bake Conditions	87
D Safety Requirements	89
E Quality and Reliability Requirements	91
E.1 Intel Verification Criteria for the Reference Designs	91
E.1.1 Reference Heatsink Thermal Verification	91
E.1.2 Environmental Reliability Testing	91
E.1.3 Material and Recycling Requirements	93
F Enabled Suppliers Information	95
F.1 Supplier Information	95
F.1.1 Intel Enabled Suppliers	95

Intel X5472 Mechanical Design Guidelines - Page 46

Isometric View of the 2U+ CEK Heatsink

Page 46 highlights