Intel X5472 Mechanical Design Guidelines - Page 4

4

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

D

Safety Requirements

................................................................................................

89

E

Quality and Reliability Requirements

.......................................................................

91

E.1

Intel Verification Criteria for the Reference Designs

................................................

91

E.1.1

Reference Heatsink Thermal Verification

....................................................

91

E.1.2

Environmental Reliability Testing

..............................................................

91

E.1.3

Material and Recycling Requirements

.........................................................

93

F

Enabled Suppliers Information

.................................................................................

95

F.1

Supplier Information

..........................................................................................

95

F.1.1

Intel Enabled Suppliers

............................................................................

95

F.1.2

Additional Suppliers

................................................................................

96

Figures

2-1

Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3)

............

15

2-2


............

16

2-3


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17

2-4

Processor Case Temperature Measurement Location

...............................................

19

2-5

DTS Domain for Quad-Core Intel® Xeon® Processor 5400 Series

............................

21

2-6

Processor Core Geometric Center Locations

...........................................................

23

2-7

Thermal Profile Diagram

.....................................................................................

24

2-8

TCONTROL Value and Digital Thermal Sensor Value Interaction

................................

25

2-9

TCONTROL and Thermal Profile Interaction

............................................................

26

2-10

Dual Thermal Profile Diagram

..............................................................................

27

2-11

Thermal Profile for the Quad-Core Intel® Xeon® Processor X5400 Series

..................

29

2-12

Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series

.......................

30

2-13

Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series

.......................

31

2-14

TCONTROL and Fan Speed Control

.......................................................................

33

2-15

Processor Thermal Characterization Parameter Relationships

...................................

35

2-16

Exploded View of CEK Thermal Solution Components

..............................................

39

2-17

2U+ CEK Heatsink Thermal Performance

...............................................................

41

2-18

1U CEK Heatsink Thermal Performance

.................................................................

42

2-19

2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400

Series Thermal Profile A

......................................................................................

43

2-20

1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400

Series Thermal Profile B

......................................................................................

44

2-21

1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400

Series Thermal Profile

........................................................................................

45

2-22

Isometric View of the 2U+ CEK Heatsink

...............................................................

46

2-23

Isometric View of the 1U CEK Heatsink

.................................................................

46

2-24

CEK Spring Isometric View

..................................................................................

48

2-25

Isometric View of CEK Spring Attachment to the Base Board

...................................

48

2-26

Boxed Active CEK Heatsink Solutions with PWM/DTS Control

(Representation Only)

........................................................................................

49

2-27

Fan Cable Connection (Active CEK)

......................................................................

50

A-1

Isometric View of the 1U Alternative Heatsink

........................................................

53

A-2

1U Alternative Heatsink Thermal Performance

.......................................................

54

A-3

1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®

Processor L5400 Series Thermal Profile

.................................................................

55

B-1

2U CEK Heatsink (Sheet 1 of 4)

...........................................................................

58

B-2


...........................................................................

59

B-3


...........................................................................

60

B-4


...........................................................................

61

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations	18
2.2 Processor Thermal Parameters and Features	19
2.2.1 Thermal Control Circuit and TDP	19
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	21
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series	26
2.2.8 Performance Targets	28
2.3 Fan Fail Guidelines	32
2.4 Characterizing Cooling Solution Performance Requirements	33
2.4.1 Fan Speed Control	33
2.4.2 Processor Thermal Characterization Parameter Relationships	34
2.4.3 Chassis Thermal Design Considerations	36
2.5 Thermal/Mechanical Reference Design Considerations	37
2.5.1 Heatsink Solutions	37
2.5.2 Thermal Interface Material	38
2.5.3 Summary	38
2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	39
2.5.5 Thermal Solution Performance Characteristics	41
2.5.6 Thermal Profile Adherence	42
2.5.7 Components Overview	45
2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile	49
A 1U Alternative Heatsink Thermal/Mechanical Design	53
A.1 Component Overview	53
A.2 Thermal Solution Performance Characterics	54
A.3 Thermal Profile Adherence	54
B Mechanical Drawings	57
C Heatsink Clip Load Methodology	83
C.1 Overview	83
C.2 Test Preparation	83
C.2.1 Heatsink Preparation	83
C.2.2 Typical Test Equipment	86
C.2.3 Test Procedure Examples	86
C.2.4 Time-Zero, Room Temperature Preload Measurement	86
C.2.5 Preload Degradation under Bake Conditions	87
D Safety Requirements	89
E Quality and Reliability Requirements	91
E.1 Intel Verification Criteria for the Reference Designs	91
E.1.1 Reference Heatsink Thermal Verification	91
E.1.2 Environmental Reliability Testing	91
E.1.3 Material and Recycling Requirements	93
F Enabled Suppliers Information	95
F.1 Supplier Information	95
F.1.1 Intel Enabled Suppliers	95

Intel X5472 Mechanical Design Guidelines - Page 4

s, 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 - x5482

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