Intel X5472 Mechanical Design Guidelines - Page 11
Table 1-2., Terms and Descriptions Sheet 2 of 2, RS - Wolfdale Processor Family BIOS Writers Guide BWG
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Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) TCONTROL TOFFSET TDP Thermal Monitor Thermal Profile TIM TLA TSA U A processor unique value for use in fan speed control mechanisms. TCONTROL is a temperature specification based on a temperature reading from the processor's Digital Thermal Sensor. TCONTROL can be described as a trigger point for fan speed control implementation. TCONTROL = -TOFFSET. An offset value from the TCC activation temperature value programmed into each processor during manufacturing and can be obtained by reading the IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the RS - Wolfdale Processor Family BIOS Writers Guide (BWG) for further details. Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. A feature on the processor that can keep the processor's die temperature within factory specifications under normal operating conditions. Line that defines case temperature specification of a processor at a given power level. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § Quad-Core Intel® Xeon® Processor 5400 Series TMDG 11