Intel X5472 Mechanical Design Guidelines - Page 14

Quad-Core Intel® Xeon® Processor 5400 Series Package

Page 14 highlights

Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications. The Quad-Core Intel® Xeon® Processor 5400 Series mechanical drawing shown in Figure 2-1, Figure 2-2, and Figure 2-3 provide the mechanical information for the Quad-Core Intel® Xeon® Processor 5400 Series. The drawing is superseded with the drawing in the processor datasheet should there be any conflicts. Integrated package/ socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide. 14 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Thermal/Mechanical Reference Design
14
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
2.1.2
Quad-Core Intel® Xeon® Processor 5400 Series Package
The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip
land grid array (FC-LGA) package technology. Please refer to the
Quad-Core Intel®
Xeon® Processor 5400 Series Datasheet
for detailed mechanical specifications. The
Quad-Core Intel® Xeon® Processor 5400 Series mechanical drawing shown in
Figure 2-1
,
Figure 2-2
, and
Figure 2-3
provide the mechanical information for the
Quad-Core Intel® Xeon® Processor 5400 Series. The drawing is superseded with the
drawing in the processor datasheet should there be any conflicts. Integrated package/
socket stackup height information is provided in the
LGA771 Socket Mechanical Design
Guide
.