Intel X5472 Mechanical Design Guidelines - Page 5
Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
UPC - 735858201551
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B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 CEK Spring (Sheet 1 of 3 62 CEK Spring (Sheet 2 of 3 63 CEK Spring (Sheet 3 of 3 64 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6 65 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6 66 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6 67 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6 68 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6 69 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6 70 1U CEK Heatsink (Sheet 1 of 4 71 1U CEK Heatsink (Sheet 2 of 4 72 1U CEK Heatsink (Sheet 3 of 4 73 1U CEK Heatsink (Sheet 4 of 4 74 Active CEK Thermal Solution Volumetric (Sheet 1 of 3 75 Active CEK Thermal Solution Volumetric (Sheet 2 of 3 76 Active CEK Thermal Solution Volumetric (Sheet 3 of 3 77 1U Alternative Heatsink (1 of 4 78 1U Alternative Heatsink (2 of 4 79 1U Alternative Heatsink (3 of 4 80 1U Alternative Heatsink (4 of 4 81 Load Cell Installation in Machined Heatsink Base Pocket - Bottom View 84 Load Cell Installation in Machined Heatsink Base Pocket - Side View 85 Preload Test Configuration 85 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 5