Intel X5472 Mechanical Design Guidelines - Page 45
Components Overview
UPC - 735858201551
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Thermal/Mechanical Reference Design Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile 65 TCASE_MAX @ TDP 60 Thermal Profile Y = 0.298 * X + 43.2 55 Tcase ( C ) 50 1U CEK Reference Solution Y = 0.246 * X + 40 45 40 Note: 2.5.7 2.5.7.1 35 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Intel has also developed an 1U alternative reference heatsink design. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of weight reduction and cost savings. Refer to Appendix B for detail information. Components Overview Heatsink with Captive Screws and Standoffs The CEK reference heatsink uses snapped-fin technology for its design. It consists of a copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The mounting screws and standoffs are also made captive to the heatsink base for ease of handling and assembly as shown in Figure 2-22 and Figure 2-23 for the 2U+ and 1U heatsinks, respectively. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 45