Intel X5472 Mechanical Design Guidelines - Page 54
A.2 Thermal Solution Performance Characterics, A.3 Thermal Profile Adherence
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1U Alternative Heatsink Thermal/Mechanical Design A.2 Thermal Solution Performance Characterics Figure A-2 shows the performance of the 1U alternative heatsink. This figure shows the thermal performance and the pressure drop through fins of the heatsink versus the airflow provided. The best-fit equations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph. Figure A-2. 1U Alternative Heatsink Thermal Performance Table A-1. 1U Alternative Heatsink Thermal Mechanical Characteristics Size Height Weight Target Airflow Through Fins Mean Ψca Standard Deviation Ψca (mm) [in.] (kg) [lbs] (m3/hr) [CFM] 1U 27.00 0.24 [0.53] 25.5 [15] [1.06] (°C/W) 0.305 (°C/W) 0.0087 Pressure Drop (Pa) [in H2O] 85 [0.34] A.3 Thermal Profile Adherence The 1U alternative thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form factors. From Table A-1 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.331 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as: Equation A-1. y = 0.331*x + 40 where, y = Processor TCASE value (°C) 54 Quad-Core Intel® Xeon® Processor 5400 Series TMDG